Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate

A resin composition, thermosetting technology, applied in the fields of thermosetting resin compositions, prepregs and laminates, can solve poor curing reactivity, heat resistance, insufficient reliability, processability, curing reactivity and toughness Low thermal expansion, excellent drilling processability, and no environmental problems
CN103189418AInactive Publication Date: 2013-07-03RESONAC CORPORATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
RESONAC CORPORATION
Publication Date
2013-07-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

Provided is a process for producing a compatibilized resin which comprises reacting a cyanate compound, a siloxane resin having a hydroxy group at an end, and an epoxy resin to a specific conversion. Also provided is a thermosetting resin composition which comprises: a compatibilized resin (A1) produced by the process or a thermosetting resin (A2) obtained by reacting a cyanate compound with a siloxane resin having a hydroxy group at an end to a specific conversion; and fused silica (B) in which the surface has been treated with a trimethoxysilane compound. Furthermore provided are a prepreg, a laminate, and a wiring board each obtained using the resin composition. The thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foils, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric properties, and drillability. With the composition, increases in the density of wiring boards and high reliability thereof, which are required at present, are attained. The composition can be widely used for producing electronic appliances, etc.
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Description

technical field

[0001] The present invention relates to the ability to obtain a thermosetting resin composition excellent in low thermal expansion, copper foil adhesion, heat resistance, flame retardancy, copper clad heat resistance (T-300), dielectric properties, and drilling processability A method for producing a compatible resin, a thermosetting resin composition, a prepreg, and a laminate. Background technique

[0002] Thermosetting resin compositions are widely used in the fields of electronic devices and the like because they have a crosslinked structure and exhibit high heat resistance and dimensional stability. In particular, it is used as a prepreg or an interlayer insulating material constituting a printed wiring board on which wiring or a circuit pattern is printed, or a copper-clad laminate obtained by multilayering a printed wiring board.

[0003] In recent years, the miniaturization, light weight, and high-speed operation of electronic instruments have accele...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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