Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermosetting resin composition and application thereof

A resin composition, thermosetting technology, applied in the direction of electrical components, circuit substrate materials, printed circuit components, etc., can solve the problems of reduced interlayer adhesion of laminated boards, unsatisfactory results, and deterioration of interlayer adhesion. , to achieve the effects of improving compatibility, improving pore wall quality, and solving dispersion and settlement

Active Publication Date: 2019-03-19
珠海三臻新材料科技有限公司
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, some people use block fillers such as talc as lubricants to improve processability, but the effect is not obvious, and the addition of these block fillers further deteriorates the interlayer adhesion.
In addition, in order to improve the drilling processability, metal molybdenum compounds are added, metal molybdenum compounds such as zinc molybdate are added to the thermosetting resin composition to improve processability, and molybdenum compound particles are supported on talc, etc., which exists in the layer of laminated boards. The problem of the obvious reduction of the adhesive force between them, and the dispersibility of this type of molybdenum compound in the resin is poor, the density is also high, and it is prone to sedimentation, and satisfactory results cannot be obtained.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～15

[0063] In Examples 1 to 15, the raw materials used are basically the same, and the difference lies in the ratio of each example. In Examples 1 to 15, the use of brominated bisphenol A epoxy resin as a thermosetting resin is used as an example. Dicyandiamide is an example as the curing agent of the present invention, and 2-methylimidazole is used as an example of the accelerator of the present invention, and the use of fused silica as an inorganic filler is an example. In other applications, the above-mentioned thermosetting resin, inorganic Fillers, curing agents, and accelerators are replaced by other materials listed in the present invention, and the technical effects obtained are basically the same as those of Examples 1 to 15 of the present invention. Here, it is only used as an example, and the specific proportions refer to Table 1:

[0064] Brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530) (epoxy resin),...

Embodiment 16

[0079] With 100g brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530) (epoxy resin), 3g dicyandiamide (curing agent), 0.05g 2-methyl Add imidazole (accelerator), 100g of boehmite coated with molybdenum disulfide (Anhui Yishitong Material Technology Co., Ltd., BG601, average particle size 0.5μm) into methyl ethyl ketone (solvent), mechanically stir It is prepared into a 65wt% glue solution, then impregnated with glass fiber cloth (7628, Zhuhai Zhubo Electronic Material Co., Ltd.) (reinforcement material), forms a prepreg after heating and drying, places copper foil on both sides, and pressurizes and heats it to form a prepreg. copper laminate.

[0080] The above prepreg is made into a printed circuit board, wherein the printed circuit board contains at least one piece of the above prepreg.

Embodiment 17

[0082] With 100g brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24g novolac resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), Add 0.05g of 2-methylimidazole, 100g of E-glass micropowder (Jiangsu Lianrui New Materials Co., Ltd., DS1032, average particle size 3 μm) coated with molybdenum disulfide into butanone (solvent), and mechanically stir It is prepared into a 65wt% glue solution, and then impregnated with glass fiber cloth (7628, Zhuhai Zhubo Electronic Material Co., Ltd.) (reinforcement material), after heating and drying to form a prepreg, placing copper foil on both sides, and pressing and heating to form a prepreg copper laminate.

[0083] The above prepreg is made into a printed circuit board, wherein the printed circuit board contains at least one piece of the above prepreg.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
widthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a thermosetting resin composition and application thereof. The thermosetting resin composition contains thermosetting resin and inorganic filler, and the inorganic filler is subjected to wrapping treatment by molybdenum alkene disulfide; and on the basis of the total mass of the thermosetting resin composition, the content of the inorganic filler is 10wt%-80wt%. According to the provided thermosetting resin composition, the molybdenum alkene disulfide wraps the inorganic filler, the compatibility of the inorganic filler and a resin system can be improved effectively, and the resin composition which is uniform and stable in dispersion can be obtained without complicated dispersing equipment. Provided prepreg is prepared by dipping the thermosetting resin compositionin a reinforcing material and then drying the thermosetting resin composition, problems about dispersion and settling of a molybdenum compound are solved effectively, and the molybdenum compound can be uniformly distributed in the prepreg. A provided laminated board contains at least one prepreg; and a provided printed circuit board contains at least one prepreg.

Description

technical field [0001] The invention relates to a thermosetting resin composition and its application. Background technique [0002] Printed circuit boards have begun to develop rapidly in the direction of high precision, high density, high performance, microporosity, thinning and multi-layering, and their application range is becoming wider and wider, and the substrate material determines the printed circuit board to a large extent. performance of the circuit board. At present, in order to reduce the thermal expansion coefficient of laminates, resins with low thermal expansion coefficients are usually selected or the content of inorganic fillers is increased. However, the low thermal expansion coefficient resin has a special structure and high cost; and the method of increasing the content of inorganic filler can not only effectively reduce the thermal expansion coefficient of the compound, but also greatly reduce the cost. However, highly filled resins will significantly...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/34C08L61/06C08L79/04C08L25/06C08L63/10C08K9/10C08K3/36C08K3/34C08K3/26C08K3/22H05K1/03
CPCB32B5/02B32B17/067B32B33/00B32B2260/021B32B2260/046B32B2307/206B32B2307/734C08K3/34C08K3/36C08K9/10C08K2003/2227C08K2003/265C08L61/34C08L63/00H05K1/0373C08L61/06C08K3/40C08L79/04C08L25/06C08K3/26C08L63/10C08K3/22
Inventor 胡石开
Owner 珠海三臻新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com