Thermosetting resin composition and application thereof

A resin composition, thermosetting technology, applied in the direction of electrical components, circuit substrate materials, printed circuit components, etc., can solve the problems of reduced interlayer adhesion of laminated boards, unsatisfactory results, and deterioration of interlayer adhesion. , to achieve the effects of improving compatibility, improving pore wall quality, and solving dispersion and settlement
CN109486111AActive Publication Date: 2019-03-19珠海三臻新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
珠海三臻新材料科技有限公司
Publication Date
2019-03-19

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Abstract

The invention discloses a thermosetting resin composition and application thereof. The thermosetting resin composition contains thermosetting resin and inorganic filler, and the inorganic filler is subjected to wrapping treatment by molybdenum alkene disulfide; and on the basis of the total mass of the thermosetting resin composition, the content of the inorganic filler is 10wt%-80wt%. According to the provided thermosetting resin composition, the molybdenum alkene disulfide wraps the inorganic filler, the compatibility of the inorganic filler and a resin system can be improved effectively, and the resin composition which is uniform and stable in dispersion can be obtained without complicated dispersing equipment. Provided prepreg is prepared by dipping the thermosetting resin compositionin a reinforcing material and then drying the thermosetting resin composition, problems about dispersion and settling of a molybdenum compound are solved effectively, and the molybdenum compound can be uniformly distributed in the prepreg. A provided laminated board contains at least one prepreg; and a provided printed circuit board contains at least one prepreg.
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Description

technical field

[0001] The invention relates to a thermosetting resin composition and its application. Background technique

[0002] Printed circuit boards have begun to develop rapidly in the direction of high precision, high density, high performance, microporosity, thinning and multi-layering, and their application range is becoming wider and wider, and the substrate material determines the printed circuit board to a large extent. performance of the circuit board. At present, in order to reduce the thermal expansion coefficient of laminates, resins with low thermal expansion coefficients are usually selected or the content of inorganic fillers is increased. However, the low thermal expansion coefficient resin has a special structure and high cost; and the method of increasing the content of inorganic filler can not only effectively reduce the thermal expansion coefficient of the compound, but also greatly reduce the cost. However, highly filled resins will significantly...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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