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Preparation method of low expansion high temperature resistant adhesive

A high temperature resistant and adhesive technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of low heat resistance level, poor high temperature stability of glued joints, complex process conditions of glued joints, etc. Achieving the effect of low expansion characteristics

Active Publication Date: 2017-11-03
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of low heat-resistant grade of existing silicone resin adhesives, complex process conditions required for the formation of adhesive joints, poor high-temperature stability of adhesive joints, and poor thermal shock resistance, and provides a low-expansion high-temperature-resistant adhesive and its Preparation

Method used

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  • Preparation method of low expansion high temperature resistant adhesive
  • Preparation method of low expansion high temperature resistant adhesive

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specific Embodiment approach 1

[0017] Specific embodiment 1: The low-expansion high-temperature resistant adhesive of this embodiment includes 5-40 parts by weight of silicone resin, 1-5 parts of silane coupling agent, 0.5-5 parts of curing agent, 10-40 parts of High temperature filler, 5-20 parts of inorganic fiber and 20-40 parts of organic solvent.

specific Embodiment approach 2

[0018] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the silicone resin is one or more of methyl silicone resin, phenyl silicone resin, and methyl phenyl silicone resin combined in any ratio. mixture. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0019] Specific embodiment three: this embodiment is different from specific embodiment one or two in that: the silane coupling agent is a mixture of one or more of KH560, KH550, and hexamethyldisilazane in any ratio . Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a preparation method of a low-expansion high-temperature-resistant adhesive, relating to an adhesive and a preparation method thereof. The invention aims to solve the problems of low heat-resistant level of the existing silicone resin adhesive, complex technological conditions required for the formation of glued joints, poor high-temperature stability and poor thermal shock resistance of the glued joints. The adhesive includes silicone resin, silane coupling agent, curing agent, high temperature resistant filler, inorganic fiber and organic solvent. Method: 1. Dissolve the first part of silicone resin in an organic solvent, then add methyltriethoxysilane, stir to obtain component A; 2. Dissolve the second part of silicone resin in an organic solvent, add water, silane Coupling agent, high temperature resistant filler, reaction, drying under reduced pressure to obtain surface-modified filler, after drying, mixed by planetary ball mill; 3. Mix modified filler, curing agent and inorganic fiber to obtain component B; 4. 1. Mix component A and component B to obtain a low-expansion high-temperature-resistant adhesive. The invention is used for preparing adhesives.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] With the wide application of special ceramic materials in the aerospace field, especially the application requirements of low-expansion materials, new requirements are put forward for high-temperature resistant adhesives. Under high temperature conditions, both the ceramic material and the adhesive will undergo a certain thermal expansion. When the thermal expansion of the two matches, the adhesive joint has good thermal stability; lead to bond failure. [0003] As a functional resin, silicone resin has advantages that other resins cannot replace. It has good temperature resistance, weather resistance and radiation resistance, etc., and has been widely used in the aerospace field. As the main component of an adhesive, silicone resin, that is, silicone adhesive, has been extensively studied at home and abroad. However, the currently developed silicone...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J11/04C09J11/06
Inventor 刘丽钟正祥徐慧芳黄玉东
Owner HARBIN INST OF TECH
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