Flip-chip substrate, manufacturing method thereof, and LED packaging structure based on the flip-chip substrate

Abstract

The invention provides a flip-chip substrate which comprises a copper heat sink plate. An insulating tape is embedded in the copper heat sink plate, and the copper heat sink plate is divided into two electrodes by the insulating tape; and tungsten-copper alloy bosses for fixing LED (Light Emitting Diode) chip are respectively welded on the two electrodes, and electroplating layers are arranged on the surfaces of the tungsten-copper alloy bosses. The flip-chip substrate is simple in structure, the manufacturing process flow of the substrate is simplified, and the production cost is greatly lowered; the installation height of the LED chips in a lamp can be enhanced by the tungsten-copper alloy bosses, so that more light emitted from the LED chips can be perpendicularly incident on the working surface of a packaged lens, and the problem that an adhesive for the lens of the conventional ceramic substrate influences a light out-coupling efficiency is solved; and furthermore, the positive and negative poles of the LED chips are directly and conductively connected with the tungsten-copper alloy bosses, a gold wiring process of the conventional process is avoided, and thus the packaging process flow of the LED chips can be further simplified.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a flip-chip substrate, a manufacturing method thereof, and an LED packaging structure based on the flip-chip substrate. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that converts electrical energy into light energy. With the advantages of low power consumption, good light concentrating effect, fast response, strong controllability, high impact resistance, long service life, and environmental protection, LED is gradually replacing traditional light sources and becoming the fourth-generation light source. [0003] Although LED is energy-saving, but like ordinary incandescent lighting, part of the energy is converted into light, and another part of the energy is converted into heat, especially LED is a point-shaped light source, and the heat generated by it is also concentrated in a very small area. The heat generated cannot b...

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Problems solved by technology

[0003] Although LED is energy-saving, but like ordinary incandescent lighting, part of the energy is converted into light, and another part of the energy is converted into heat, especially LED is a point-shaped light source, and the heat generated by it is also concentrated in a very small area. The heat generated cannot be dissipated in time, and the junction temperature of the PN junction will rise, which will accelerate the aging of the chip and packaging materials, and may also cause the solder joints to melt, causing the chip to fail, which will directly affect the service life and luminous performance of the LED, especially High-power LEDs generate more heat and require higher heat dissipation technology

[0004] Ceramic substrates have the advantages of high heat dissipation, low thermal resistance, long life, wide operating temperature, and withstand voltage. However, the preparation of ceramic heat dissipation substrates requires high equipment and technology, and the manufacturing process is quite complicated. , evaporation, sputtering, electroplating, and electroless plating make the ceramic substrate expensive

In addition, in the traditional ceramic substrate, the bonding glue of the packaging lens and the copper-metal composite layer will have a certain impact on the light output of the LED chip. This part of the glue blocks a part of the light emitted from the side of the LED chip, making the use of LED side light rate drop

For this problem, technical personnel in the industry have also proposed improvements, such as the Chinese patent No. 201220168404.8, which discloses a substrate structure for LED chip packaging, although this solution solves the problem of using traditional ceramic substrates to reduce the lateral light output rate of LED chips. problem, but the design of the circuit layer and the micron-scale ultra-thin ceramic insulating layer increases the complexity of the process. In addition, the patent uses a tungsten-copper alloy panel with bosses, which increases the cost of materials, making this packaging substrate The costly problem remains unresolved

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