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Biological recognition module with excellent capability resistant to external force and preparation method thereof

A technology of biometric identification and modules, applied in biometric identification, character and pattern identification, printed circuit manufacturing, etc., can solve the problems that traditional solutions cannot meet the application environment, cannot pass the falling ball impact test or static pressure test, etc.

Pending Publication Date: 2018-06-01
JIANGXI HOLITECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of technology, circuit boards are widely used in electronic products. With the development of products, the requirements for the ability of biometric modules to resist external forces are getting higher and higher. Traditional solutions cannot meet all application environments, usually showing that they cannot pass through falling balls. Shock test or static pressure test

Method used

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  • Biological recognition module with excellent capability resistant to external force and preparation method thereof
  • Biological recognition module with excellent capability resistant to external force and preparation method thereof
  • Biological recognition module with excellent capability resistant to external force and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 As shown, the biometric module with high resistance to external force includes a chip layer 1, a connecting layer 2 and a circuit board 3 from top to bottom, wherein the chip layer 1 includes an epoxy resin covering layer 11, The crystal protection layer 12 , the wafer 13 , the adhesive 14 and the substrate 15 , the connection layer 2 includes solder 21 and an underfill 22 filled between the solder 21 . It is worth noting that the underfill 22 is located between the chip layer 1 and the circuit board 3 , and the underfill 22 circles around the chip layer 1 and has an air vent. In actual production, it is necessary to apply the underfill glue 22 on the periphery of the chip layer 1 by filling glue twice, so that the underfill glue 22 fills the entire lower part of the chip layer 1 . In order to ensure that the underfill 22 can pass through the capillary coverage smoothly, it is necessary to reserve an exhaust port on the gluing path around the chip laye...

Embodiment 2

[0041] According to the biometric identification module with high resistance to external force proposed in the above embodiments, this embodiment proposes a method for preparing a biometric identification module with high resistance to external force.

[0042] A method for preparing a biometric module with high resistance to external force, comprising the steps of:

[0043] S1. Attaching the crystal protection layer 12 on the upper surface of the wafer 13;

[0044] S2, polishing the wafer 13;

[0045] S3, using the adhesive 14 to fix the wafer 13 on the substrate 15 to form a chip;

[0046] S4, setting a layer of epoxy resin covering layer 11 on the crystal protective layer 12, the thickness of the epoxy resin covering layer 11 is greater than or equal to 85 μm;

[0047] S5. Using the connection layer 2 to fix the chip on the circuit board 3 to form a biometric identification module.

[0048] In the above-mentioned preparation method of the biometric module with high resist...

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Abstract

The invention provides a biological recognition module with an excellent capability resistant to external force and a preparation method thereof. The biological recognition module comprises a chip layer, a connection layer and a circuit board successively from top to bottom. The chip layer successively comprises, from top to bottom, an epoxy resin covering layer, a wafer protection layer, a wafer,an adhesive, and a substrate. The connection layer includes solder tin and an underfill adhesive filling gaps between the solder tin. The underfill adhesive is located between the chip layer and thecircuit board, is wound around the chip layer by one round, and is provided with a row of exhaust ports. In the module and method, the final purpose of widening a solder tin space, increasing the solder tin height, cleaning the scaling powder, filling adhesive two times, and pressurizing and curing the underfill adhesive is to fill a gap between the substrate and the circuit board in order that the biological recognition module itself does not have a forced blank area when impacted by external force.

Description

technical field [0001] The invention relates to the field of identification module preparation, in particular to a biometric identification module with high resistance to external force and a preparation method thereof. Background technique [0002] With the development of technology, circuit boards are widely used in electronic products. With the development of products, the requirements for the ability of biometric modules to resist external forces are getting higher and higher. Traditional solutions cannot meet all application environments, usually showing that they cannot pass through falling balls. Impact test or static pressure test. Contents of the invention [0003] The technical solution of the present invention is: a biometric identification module with high resistance to external force, the biometric identification module includes a chip layer, a connection layer and a circuit board from top to bottom, and the chip layer from top to bottom sequentially Includin...

Claims

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Application Information

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IPC IPC(8): G06K9/00H05K3/34
CPCH05K3/341G06V40/10
Inventor 林清柳希超
Owner JIANGXI HOLITECH TECH