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Semiconductor device

一种半导体、导电类型的技术,应用在半导体器件、电气元件、电路等方向,能够解决开关速度不充分等问题,达到提高开关速度的效果

Active Publication Date: 2018-06-08
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in this technique, the improvement in switching speed may not be sufficient

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0051] figure 1 as well as figure 2 Each is a partial cross-sectional view schematically showing the structure of the MOSFET 901 (semiconductor device) in this embodiment. figure 1 vision along the figure 2 the line I-I, figure 2 vision along the figure 1 The line II-II.

[0052] In MOSFET 901, when viewed from above (with figure 2 The corresponding field of view, in other words, the field of view corresponding to the plane perpendicular to the thickness direction), exists in the length direction ( figure 2 A plurality of active strip-shaped regions RA extending in the lateral direction) and a plurality of contact strip-shaped regions RC extending in the longitudinal direction. In MOSFET 901, in the direction perpendicular to the length direction ( figure 2 In the longitudinal direction), the active strip-shaped region RA and the contact strip-shaped region RC are alternately and repeatedly arranged, thereby providing a strip-shaped pattern. The active band re...

Embodiment approach 2

[0109] Figure 16 as well as Figure 17 Each is a partial cross-sectional view schematically showing the structure of the MOSFET 908 (semiconductor device) in this embodiment. Figure 16 vision along the Figure 17 The lines XVI-XVI, Figure 17 vision along the Figure 16 Lines XVII-XVII. also, Figure 16 vision and figure 2 same, Figure 17 vision and figure 1 same.

[0110] MOSFET 908 except MOSFET 901 ( figure 1 as well as figure 2 ) structure, also has a support area 207. The supporting region 207 protrudes from the bottom of the strap-shaped trench TS separately from the source electrode 5 between the active strap-shaped region RA and the contact strap-shaped region RC. Therefore, the support region 207 is not connected to the source electrode 5 and therefore has no electrical function. The support region 207 has a pair of opposite sides. The strip-shaped gate electrode 204S has portions adjacent to each of a pair of side surfaces of the support region 2...

Embodiment approach 3

[0122] Figure 18 as well as Figure 19 Each is a partial cross-sectional view schematically showing the structure of the MOSFET 909 (semiconductor device) in this embodiment. Figure 18 vision along the Figure 19 of lines XVIII-XVIII, Figure 19 vision along the Figure 18 The lines XIX-XIX. also, Figure 18 vision and figure 2 same, Figure 19 vision and figure 1 same.

[0123] The MOSFET 909 differs from the MOSFET 901 only in the structure of the active band region RA. Specifically, MOSFET 909 except MOSFET 901 ( figure 1 as well as figure 2 ) structure, it also has a middle trench TM and a middle gate electrode 204M. The middle trench TM is provided between two adjacent strip-shaped trenches TS among the plurality of strip-shaped trenches TS. The middle trench TM penetrates the source region 303 and the base region 302 to reach the drift layer 2 . The depth of the middle trench TM is smaller than that of the strip-shaped trench TS. The protective diffu...

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PUM

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Abstract

An interlayer insulating film (6) covers, with a thickness that is larger than that of a gate insulating film (305), a stripe gate electrode (204S), and is provided with a first contact hole (CH1) outside of a stripe trench (TS), and a second contact hole (CH2) in the stripe trench (TS). In plan view, active stripe regions (RA) and contact stripe regions (RC) extend in the long-side direction. Theactive stripe regions (RA) and the contact stripe regions (RC) are alternately disposed repeatedly in the direction perpendicular to the long-side direction. In each of the active stripe regions (RA), a source electrode (5) is connected to a source region (303) via the first contact hole (CH1). In each of the contact stripe regions, the source electrode (5) is connected to a protection diffusionlayer (306) via the second contact hole (CH2).

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly, to a trench gate type semiconductor device for electric power. Background technique [0002] In power electronic equipment, IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) and MOSFET (Metal Oxide Semiconductor Field Effect Transistor, Metal Oxide Semiconductor Field Effect Transistor) are widely used as switching elements that control power supply to loads such as motors ) and other insulated gate semiconductor devices. In view of energy saving, the power loss of the switching element is preferably small. On-resistance is included in the index indicating this loss. The on-resistance indicates the electrical resistance between the drain and the source when the MOSFET is turned on. As a switching element suitable for reducing on-resistance, there is a trench gate MOSFET having a gate electrode buried in a semiconductor layer. Trench gate MOSFET...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/12H01L29/423H01L29/49
CPCH01L29/41766H01L29/66068H01L29/417H01L29/45H01L29/7396H01L29/7397H01L29/0696H01L29/407H01L29/7813H01L29/0623H01L29/1608H01L29/49H01L29/78H01L29/41725H01L29/42316
Inventor 菅原胜俊田中梨菜福井裕足立亘平小西和也
Owner MITSUBISHI ELECTRIC CORP