Semiconductor wafer electro-deposition method and semiconductor wafer electro-deposition device
An electrodeposition device, semiconductor technology, applied in the direction of semiconductor devices, circuits, electrolytic components, etc., can solve the problems of lower production efficiency, deposition layer color, abnormal appearance and quality of deposition layer, etc., to improve uniformity and eliminate electrodeposition edges The effect of improving efficiency and uniformity
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[0024] The technical solutions of the present invention will be further described below in conjunction with the drawings and specific implementations.
[0025] Preferred embodiment:
[0026] The preferred embodiment discloses a semiconductor wafer electrodeposition method. In this electrodeposition method, the anode is electrodeposited only for the middle of the semiconductor wafer to be electrodeposited, so as to avoid the concentration of electric field lines at the edge of the semiconductor wafer to be electrodeposited and cause edge effects. The specific area, specific shape, and the percentage of the area occupied by the "central part" on the entire semiconductor wafer to be electrodeposited are not limited, and are determined according to specific needs, which can prevent electric field lines from being deposited on the semiconductor wafer to be electrodeposited. The purpose of concentrating at the edge and generating edge effect is sufficient.
[0027] Such as figure 1 with ...
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