An electronic device packaging device

Abstract

The invention relates to the technical field of packaging, and specifically discloses a packaging device for an electronic device. The packaging device comprises a feeding part, an adsorption part anda placement part, wherein the feeding part comprises a cylinder body, a first cylinder and an adsorption body, a gas cavity with an opening in the bottom is formed in the lower end of the cylinder body, the upper part of the adsorption body is inserted into the gas cavity, the first cylinder is installed in the cylinder body, the first cylinder is capable of driving the adsorption body to stretchout of or retreat back into the gas cavity, a gas hole communicating with the gas cavity is formed in the sidewall of the lower part of the adsorption body; the adsorption part comprises a dust removal pipe, a fan and an air pipe, an air channel is formed between the dust removal pipe and the air pipe, the middle part of the air pipe is sunken inwards, the upper part of the air channel communicates with the fan, and strip-shaped slits are formed in the sidewall of the dust removal pipe; sealing parts are arranged above and below the adsorption part separately, and each sealing part comprisestwo oppositely-arranged second cylinders and two oppositely-arranged hot-pressing blocks; and the placement part comprises a seat body and a workbench, the workbench is slidably connected to the seatbody, and a pressure spring is arranged below the workbench. The electronic device can be subjected to dust removal while being packaged, and the packaged bag body is enabled to be bulged.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to an electronic device packaging device. Background technique [0002] When dust is adsorbed on the surface of the electronic device, it will have an impact on the performance of the electronic device, and since the surface of the electronic device itself is prone to generate static electricity, the electronic device is easy to absorb dust. Therefore, when packaging electronic devices, it is necessary to remove dust from the electronic devices first. In the current packaging process of electronic devices, the dust removal and packaging of electronic devices are carried out separately. Transmission process, which will result in reduced packaging efficiency. In addition, electronic devices are easily damaged when they are squeezed. Therefore, when packaging electronic devices, it is usually necessary to inflate the packaging bag so that the packaging bag after packaging the electr...

AI Technical Summary

Problems solved by technology

In the existing packaging process, after the electronic device is packed into the packaging bag, the packaging bag needs to be inflated, and then the packaging bag is sealed to ensure that the packaging bag is bulging, but when inflating and sealing , it is easy to crush the packaging bag, so when packaging electronic devices, the operator needs to have rich packaging experience

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