Method of packaging electronic devices

A technology of electronic devices and plastic films, which is applied in the field of packaging electronic devices, and can solve problems such as packaging bag collapse

Active Publication Date: 2019-11-05
江门市富可鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing packaging process, after the electronic device is packed into the packaging bag, the packaging bag needs to be inflated, and then the packaging bag is sealed to ensure that...

Method used

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  • Method of packaging electronic devices
  • Method of packaging electronic devices
  • Method of packaging electronic devices

Examples

Experimental program
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Embodiment Construction

[0029] The present invention will be described in further detail below by means of specific embodiments:

[0030] The reference signs in the accompanying drawings of the specification include: cylinder 10, first cylinder 11, adsorption body 12, first channel 13, first check valve 14, second check valve 15, ring body 16, blade 17, guide Air piece 18, air hole 19, upper sealing part 20a, lower sealing part 20b, hot pressing block 21, second wedge surface 23, first wedge surface 24, adsorption part 30, air duct 31, dust removal pipe 32, strip slit 33. Fan 34, seat body 40, workpiece table 41, pressure spring 42, plastic packaging film 50, electronic device 60

[0031] The method for packaging the electronic device 60 in this embodiment uses a packaging device for the electronic device 60 . Such as figure 1 , figure 2 and image 3As shown, the applied electronic device 60 packaging device includes a feeding part, an adsorption part 30 and a placing part in order from top to b...

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PUM

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Abstract

The application relates to the technical field of packaging and particularly discloses a method of packaging an electronic device, comprising the steps of (1) sleeving a column above a suction portionwith plastic film in tubular shape; (2) activating a fan, and placing an electronic device to be packaged onto a workbench; (3) pulling down the plastic film until air holes in the lower portion of the suction portion are covered; (4) pushing down the suction portion so as to pull the plastic film into a dedusting barrel; (5) after the plastic film is sucked onto the inner wall of the dedusting barrel, pulling back the suction portion, and cutting the plastic film; (6) enabling two hot pressers of a sealing portion to move to each other, and separating the hot pressers after the plastic filmis press-fitted by the hot pressers; (7) taking out the packaged electronic device. During packaging of an electronic device by means of the method, the electronic device can be dedusted, and a post-packaging bag is bulged.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a method for packaging electronic devices. Background technique [0002] When dust is adsorbed on the surface of the electronic device, it will have an impact on the performance of the electronic device, and since the surface of the electronic device itself is prone to generate static electricity, the electronic device is easy to absorb dust. Therefore, when packaging electronic devices, it is necessary to remove dust from the electronic devices first. In the current packaging process of electronic devices, the dust removal and packaging of electronic devices are carried out separately. Transmission process, which will result in reduced packaging efficiency. In addition, electronic devices are easily damaged when they are squeezed. Therefore, when packaging electronic devices, it is usually necessary to inflate the packaging bag so that the packaging bag after packaging the el...

Claims

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Application Information

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IPC IPC(8): B65B11/52B65B63/00
CPCB65B11/52B65B63/00
Inventor 车臣飞
Owner 江门市富可鑫电子有限公司
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