ACF (anisotropic conductive film) press-fitting device and attaching device

Abstract

An embodiment of the invention provides an ACF (anisotropic conductive film) press-fitting device and attaching device, relates to the technical field of attachment and may solve the problem of the prior art that during press-fitting and attaching ACF by ACF press-fitting device, attaching is poor since the position of a buffer tape at the front end of a tool tip relative to the tool tip easily moves. The ACF press-fitting device comprises: a tool tip, wherein a first limiting strip is arranged at the front of the tool tip and is extended along the length of the tool tip; a buffer portion in elongated shape, wherein the buffer portion includes a press-fitting face that is horizontal, the part of the buffer portion facing the press-fitting face is provided with a second limiting strip, wherein the first limiting strip and the second limiting strip are in fitly connection so as to limit the relative motion of the tool tip and the buffer portion along the width of the tool tip, and the relative position of the tool tip and the buffer portion along the height of the tool tip is fixed.

Description

technical field [0001] The invention relates to the field of sticking technology, in particular to an ACF pressing device and a sticking device. Background technique [0002] In the manufacturing process of the display device, most display panels need to connect a driver chip (Integrated Circuit, IC for short) to control the signal at the periphery. A layer of ACF (Anisotropic Conductive Film, anisotropic conductive film). [0003] At present, an ACF attachment device (also called ACF Bonder equipment) is often used to attach ACF to the substrate or panel (Panel) to be attached. The ACF attachment device includes a feeding device and a pressing device (ACF Bonding Unit, which can be called ACF binding unit) and a cutter device, etc., wherein the feeding device is used to provide ACF; the pressing device is used to press and attach the ACF to the substrate to be attached; the cutter device is used to cut the ACF. Existing ACF pressing devices such as figure 1 As shown, sin...

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide an ACF pressing device and an attaching device, which can solve the problem of the ACF pressing device pressing and attaching ACF in the prior art because the buffer strip at the front end of the cutter head is easy to move relative to the position of the cutter head. The problem of bad attachment caused by

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