Device for dissociating and transferring slice material

Abstract

The invention provides a device for dissociating and transferring a slice material. The device comprises a cleaning groove and a dragging shovel, wherein a device adhered with the slice material is located right above the cleaning groove; the dragging shovel is used for moving and fetching the slice material and comprises a dragging shovel handle and an insertion roll, and the insertion roll is used for supporting the slice material during the moving and fetching. According to the device, the stress of the slice material during the dissociation and transfer can be greatly reduced, so that thefragmenting rate is greatly reduced; and the device is simple in design, low in preparation cost and convenient to operate and can be optimized and flexibly improved according to actual conditions.

Description

Technical field [0001] The present invention relates to the field of semiconductors, in particular to a wafer-level semiconductor material and a tray are bonded with low-temperature paraffin wax or other suitable adhesives, and then the semiconductor material is thinned to a thickness of less than 100um to realize a thin semiconductor material and a tray. A device for dissociation and transfer of sheet material. Background technique [0002] In the field of semiconductor processing, wafer-level semiconductor materials or smaller incomplete semiconductor wafers, after the corresponding pre-process, it is necessary to first attach the semiconductor sheet material and a hard, flat and smooth tray material through electrostatic adsorption , Photosensitive adhesive tape, high temperature failure tape or low temperature paraffin wax and other methods to bond between the two, and then after the thinning process, the semiconductor sheet and the tray are separated, and the semiconductor s...

AI Technical Summary

Problems solved by technology

Since the thinned semiconductor sheet material has a thickness of less than 100um, it is extremely fragile. In order to ensure that the sheet is dissociated from the tray and transferred, the phenomenon of fragmentation caused by excessive stress on the sheet material should be minimized; First of all, for the electrostatic adsorption method, the cost is high and it is very easy to appear that the electrostatic adsorption force in the local area still exists when the electrostatic adsorption force is eliminated, causing the sheet material to be subjected to uneven electrostatic force or sudden electrostatic force when it leaves the tray. In the process of rapid dissociation caused by failure, it is broken by excessive stress; secondly, for the method of photosensitive or high-temperature failure tape, unevenness and air bubbles between the sheet material and the tray are prone to occur when the tape is glued, and the sheet material When detaching, there is still sticking and not easy to fall off, which greatly increases the cost and fragmentation rate; finally, the traditional paraffin dissociation thin section method needs to use tweezers or push rods to push the thin section material to dissociate from the tray, which increases the dissociation time of the thin section. The stress of separation greatly increases the fragmentation rate

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