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Surface-regulatory flexible microgroove heat sink, heat dissipation device and method

A heat dissipation method and heat dissipation device technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment construction parts, etc., can solve the problem of poor hydrophilicity on the surface of high molecular polymers, affecting the heat dissipation capacity of radiators, and affecting Microchannel capillary wetting height and liquid reflux capacity, etc., to achieve the effect of enhancing capillary wetting height and reflux capacity, increasing hydrophilicity, and improving capillary force

Pending Publication Date: 2018-06-29
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

Although the bending problem of the heat sink is solved by using the above materials, due to the poor hydrophilicity of the surface of the main polymer used, it affects the capillary wetting height and liquid return capacity in the micro channel, thus affecting the heat dissipation capacity of the entire radiator

Method used

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  • Surface-regulatory flexible microgroove heat sink, heat dissipation device and method

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Embodiment Construction

[0045] The present disclosure provides a flexible micro-groove group heat sink, heat dissipation device and method for surface control, by bonding hydrophilic materials on the surface of the micro-groove group of the flexible micro-groove group heat sink, the hydrophilic performance of the surface of the micro-groove group is improved, Increase the capillary force between it and the liquid working medium such as water, methanol, ethanol and other polar liquids, increase the wetting height and reflux capacity of the liquid working medium, and achieve the purpose of strengthening heat exchange.

[0046] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0047] As an exemplary embodiment of the present disclosure, a surface regulated flexible microgroove group heat sink, heat di...

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Abstract

The invention provides a surface-regulatory flexible microgroove heat sink, a heat dissipation device and a method. The flexible microgroove heat sink is prepared from a flexible heat conduction material and has multiple micro-channels in the surface, and the multiple micro-channels form a microgroove group, wherein the surfaces of the microgroove group are hydrophilic surfaces after bonding by ahydrophilic material. Further, the surface-regulatory flexible microgroove heat dissipation device and heat dissipation method are provided on the basis of the flexible microgroove heat sink. The hydrophilic material is bonded on the surfaces of the microgroove group, the capillary force between the surfaces of the microgroove group and liquid work media such as water, methanol, ethanol and otherpolar liquids is increased, the wetting height and the return capability of the liquid work media are increased, the purpose of strengthening heat exchange is achieved, the cost is low, operation is simple and the hydrophilic performance is lasting.

Description

technical field [0001] The present disclosure relates to the technical field of heat dissipation, and in particular to a heat sink, a heat dissipation device and a method for surface-regulated flexible microgroove groups. Background technique [0002] With the advancement of technology, wearable devices or flexible display devices have been increasing in recent years. Although the heat generation of flexible electronic products is less than that of traditional electronic products, because flexible electronic products have the characteristics of being bendable and light and thin, they subvert the form of traditional electronic products, and the heat generation is easier to concentrate and make the human body feel uncomfortable. It brings higher technical requirements for the heat dissipation of flexible electronic products. [0003] Now the research on flexible heat dissipation technology mainly focuses on some passive technologies, such as flexible heat pipes and flexible f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/203H05K7/20336
Inventor 莫小宝胡学功
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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