Reflow oven cooling module with flat plate type coil pipe

A technology of reflow soldering furnace and cooling mold, applied in welding equipment, auxiliary devices, metal processing equipment, etc., can solve the problems of large volume, high cost, occupying equipment space, etc., and achieves large contact area, high wind speed, and convenient maintenance and cleaning. Effect

Pending Publication Date: 2018-07-03
上海朗仕电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Outside the cooling zone, there are often some heat exchange devices. The refrigerant may be air or water. It will take up a lot of valuable equipment space, and at the same time, its cost is relatively high

Method used

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  • Reflow oven cooling module with flat plate type coil pipe
  • Reflow oven cooling module with flat plate type coil pipe
  • Reflow oven cooling module with flat plate type coil pipe

Examples

Experimental program
Comparison scheme
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Embodiment

[0028] Such as Figure 1 ~ Figure 3 As shown, a reflow oven cooling module with a flat coil is installed at the outlet end of the bottom of the reflow oven. The cooling module includes a shell 1, a cooling coil 2 and a blowing unit 3. The shell 1 has three layers. Hollow structure, from top to bottom are the air inlet layer 11, the cooling layer 12 and the air outlet layer 13 respectively, between the air inlet layer 11 and the cooling layer 12 and between the cooling layer 12 and the air outlet layer 13 through the Partitions are used to isolate the air inlet layer 11. An air inlet hole plate 5 is arranged above the air inlet layer 11. A vertically arranged air outlet cavity 4 is arranged on both sides of the housing 1. The air outlet cavity 4 is connected to the air outlet layer 13. The bottom is sealed and the top is open. The top opening is connected to the top module on the top of the reflow oven. The top module is used to blow the cooled air to the PCB board located in t...

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PUM

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Abstract

The invention relates to a reflow oven cooling module with a flat plate type coil pipe. The reflow oven cooling module with the flat plate type coil pipe is installed at the bottom outlet end of a reflow oven. The cooling module comprises a shell, the cooling coil pipe and a blowing unit. The shell is of a three-layer hollow structure and comprises an air inlet layer, a cooling layer and an air outlet layer from top to bottom, the air inlet layer and the cooling layer are separated through a separation plate with air ports, and the cooling layer and the air outlet layer are separated through aseparation plate with air ports. The two sides of the shell are provided with air outlet cavities arranged vertically, and the air outlet cavities communicate with the air outlet layer. The cooling coil pipe is in a flat plate drawer shape, penetrates through the air outlet cavity on one side and is installed in the cooling layer in a horizontally pull-out mode. Hot airflow in the reflow oven enters the cooling layer through the air inlet layer, is cooled by the cooling coil pipe in the cooling layer, and then enters the air outlet layer, and cooled airflow is brown away towards two sides through the blowing unit and exhausted from the air outlet cavities on two sides. Compared with the prior art, the cooling module is compact in structure and good in cooling effect.

Description

technical field [0001] The invention relates to a reflow oven cooling module, in particular to a reflow oven cooling module with flat coil tubes. Background technique [0002] The reflow oven is a kind of welding equipment in the SMT industry. It can provide an automatic and stable heating environment, so that the solder paste in the furnace is heated and melted, so that the pre-mounted electrical components on the PCB board and the PCB board are reliably combined through the solder alloy. At the same time, in the reflow furnace At the outlet end, there will be a cooling area, which is usually composed of one or more modules, which cool the solder paste and fix the electrical components. [0003] Outside the cooling zone, there are often some heat exchange devices. The refrigerant may be air or water. The connection between different areas will take up a lot of valuable equipment space, and at the same time, its cost is also relatively high. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K1/008
CPCB23K1/008B23K3/085
Inventor 卢明詹姆斯·内维尔大卫·海乐
Owner 上海朗仕电子设备有限公司
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