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Double-sided metal laminated board, method of manufacturing double-sided metal laminated board, and image transfer method of pattern

A technology of metal lamination and pattern transfer, which is applied to the plating of superimposed layers, metal layered products, copying/marking methods, etc., can solve the problems of wiring pattern deviation and achieve the effect of suppressing deviation

Active Publication Date: 2020-12-29
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] As mentioned above, when a large dimensional change occurs due to rapid moisture absorption, the formed wiring pattern may be misaligned, causing problems

Method used

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  • Double-sided metal laminated board, method of manufacturing double-sided metal laminated board, and image transfer method of pattern
  • Double-sided metal laminated board, method of manufacturing double-sided metal laminated board, and image transfer method of pattern
  • Double-sided metal laminated board, method of manufacturing double-sided metal laminated board, and image transfer method of pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0226] As a plastic film, polyimide film KAPTON100EN (manufactured by Toray DuPont Co., Ltd.) having a width of 0.5 m x a length of 3000 m was prepared (plastic film preparation process). Here, the prepared KAPTON 100EN had a thickness of 25 μm, and the same plastic film was used in Examples 2 and 3 and Comparative Examples 1 to 3, 7 and 8 below.

[0227] Next, a Ni-20%Cr alloy layer with a thickness of 8 nm was formed as a metal seed layer by sputtering on both surfaces of the plastic film (metal seed layer forming step). Here, the Ni-20% Cr alloy refers to a Ni-Cr alloy composed of 20% by mass of Cr and the remaining 80% by mass of Ni.

[0228] In addition, a copper layer having a thickness of 0.1 μm was formed as a first metal layer on the metal seed layers formed on both surfaces of the plastic film (first metal layer film forming step).

[0229] Here, use image 3 In the film forming apparatus 30 shown, the metal seed layer forming step and the first metal layer forming...

Embodiment 2、 Embodiment 3

[0234] A double-sided metal laminate was obtained under the same conditions as in Example 1 except that the thickness of the second metal layer was set to the thickness shown in Table 1. Table 1 shows the tolerance to the central value calculated from the evaluation results of the dimensional change rate and the calculated central value of the dimensional change rate.

Embodiment 4～ Embodiment 6

[0236] A double-sided metal laminate was obtained under the same conditions as in Example 3 except that the type of the plastic film was changed to those shown in Table 1. Table 1 shows the tolerance to the central value calculated from the evaluation results of the dimensional change rate and the calculated central value of the dimensional change rate.

[0237] Here, in Table 1, the thicknesses of KAPON140ENZ (manufactured by Toray DuPont Co., Ltd.) and KAPTON150ENA (manufactured by Toray DuPont Co., Ltd.) are 35 μm and 38 μm, respectively.

[0238] In addition, in Table 1, the thickness of UPILEX35SGAV1 (manufactured by Ube Industries, Ltd.) is 35 μm.

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Abstract

The present invention relates to a double-sided metal laminated board, a method for manufacturing a double-sided metal laminated board, and a pattern image transfer method. Provided is a double-sided metal laminated board capable of suppressing misalignment of the wiring pattern when a metal laminate disposed on the surface of a plastic film is etched to form a wiring pattern. The double-sided metal laminate includes a plastic film, a metal seed layer directly arranged on both sides of the plastic film, and a metal layer arranged on the metal seed layer, measured according to IPC‑TM‑650, 2.2.4, method C The tolerance of the rate of dimensional change of the double-sided metal laminate was within ±0.02% for MD and within ±0.01% for TD.

Description

technical field [0001] The invention relates to a double-sided metal laminated board, a manufacturing method of the double-sided metal laminated board, and a pattern image transfer printing method. Background technique [0002] Starting with mobile communication devices such as mobile phones and car phones, the demand for small and lightweight portable electronic devices such as tablet computers, e-book terminals, smart phones, MP3 players, and video game machines is expanding. Expectations are also higher for high-density mounting technology for high-density mounting of electronic components. Along with this, the multilayering of printed wiring boards, the narrowing of wiring pitches, the miniaturization of via holes, and the miniaturization and multi-pinning of IC packages are being promoted. In addition, the active components of capacitors or resistors also tend to be miniaturized, stacked and surface-mounted accordingly. [0003] In particular, the technique of directl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41M5/382C23C28/02
CPCC23C28/02B41M5/382B32B15/08B32B27/281G03F7/00B32B2255/205B32B2255/06B32B2307/734
Inventor 富泽基行
Owner SUMITOMO METAL MINING CO LTD