Light-emitting diode with sawtooth radiator sheet
A technology of light-emitting diodes and heat sinks, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of rising chip operating temperature, weakening of LED light emission, and weakening of luminous efficiency, so as to achieve the effect of increasing the heat dissipation area
Inactive Publication Date: 2018-07-03
南京澳特利光电科技有限公司
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Problems solved by technology
[0002] With the rapid development of LED technology, LEDs are used in almost every industry and gradually replace traditional light sources. LED packaging technology is also improving. The original technology of LED packaging uses ceramics as the carrier, and the temperature of the chip will rise for a long time. Heat dissipation If the degree is not good, it will further weaken the LED light emission and reduce the luminous efficiency
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[0009] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, it should be understood that following specific embodiment is only for illustrating the present invention and is not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand the invention Modifications in various equivalent forms fall within the scope defined by the appended claims of the present application.
[0010] Such as figure 1 As shown, the present invention discloses a light-emitting diode with a sawtooth heat sink, including silica gel, leads, chips, electrodes, a heat sink substrate and a thermally conductive insulating layer, characterized in that: the thermally conductive insulating layer is wrapped on the heat sink substrate In addition, the electrodes are at both ends of the heat-conducting insulating layer, the chip is in the middle of the heat-conducting insulatin...
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The invention discloses a light-emitting diode with a sawtooth radiator sheet. The light-emitting diode comprises silica gel, lead wires, a chip, electrodes, a radiator sheet substrate and a heat-conduction insulation layer. The light-emitting diode is characterized in that the heat-conduction insulation layer is wrapped outside the radiator sheet substrate; the electrodes are arranged at the twoends of the heat-conduction insulation layer respectively; the chip is placed in the middle of the heat-conduction insulation layer; the lead wires are connected between the chip and the electrodes respectively; and the silica gel is doped with nanometer light-guide particles, and wraps the chip and the lead wires on the heat-conduction insulation layer. According to the light-emitting diode withthe sawtooth radiator sheet, by designing the substrate in a manner that the heat-conduction metal material is externally wrapped by the heat-conduction insulation layer, and making the heat-conduction metal material into a sheet shape to increase heat radiating area, heat radiating efficiency is improved, heat generated by the chip is effectively transferred to the radiator sheet substrate, and the radiator sheet substrate quickly transfers the heat out, thereby achieving a very good heat dissipation effect, reducing the temperature of the chip, keeping stability of the chip and stability ofreflective efficiency.
Description
technical field [0001] The invention relates to a packaging technology of a light-emitting diode, in particular to a light-emitting diode with sawtooth cooling fins. Background technique [0002] With the rapid development of LED technology, LEDs are used in almost every industry and gradually replace traditional light sources. LED packaging technology is also improving. The original technology of LED packaging uses ceramics as the carrier, and the temperature of the chip will rise for a long time. Heat dissipation If the degree is not good, it will further weaken the LED light emission and reduce the luminous efficiency. Contents of the invention [0003] In view of the above problems, the present invention discloses a light-emitting diode with sawtooth cooling fins. The substrate is designed as a heat-conducting metal material wrapped with a heat-conducting insulating layer, and the heat-conducting material is shaped into a sheet to increase the heat dissipation area. ,...
Claims
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IPC IPC(8): H01L33/64
CPCH01L33/641H01L33/642
Inventor 不公告发明人
Owner 南京澳特利光电科技有限公司