Composite circuit board and manufacturing method thereof

Abstract

A composite circuit board comprises an insulation layer, a first inner-layer plate, a first circuit layer, a second circuit layer, a third circuit layer and a fourth circuit layer, wherein the first inner-layer plate is embedded into the insulation layer, the third circuit layer and the fourth circuit layer are arranged on surfaces of two sides of the insulation layer, the third circuit layer electrically communicates with the first circuit layer, the fourth circuit layer electrically communicates with the second circuit layer, the first inner-layer plate is arranged at a middle part of the insulation layer, the first circuit layer and the second circuit layer are respectively arranged at two sides of the first inner-layer plate at intervals, the insulation layer comprises light-sensitiveresin, a plurality of first conductive through holes are formed between the first circuit layer and the first inner-layer plate, second conductive through holes are formed between the second circuit layer and the first inner-layer plate, the first circuit layer and the first inner-layer plate are connected via the first conductive through holes, and the second circuit layer and the first inner-layer plate are connected via the second conductive through holes.

Description

technical field [0001] The invention relates to a circuit board, in particular to a composite circuit board and a manufacturing method thereof. Background technique [0002] Nowadays, in order to meet the diversified development of functions of various electronic devices, composite circuit boards have been widely used due to their advantages of lightness, thinness and high circuit density. [0003] Generally, a composite circuit board is formed by combining a flexible circuit board and a rigid circuit board through processes such as bonding and pressing, and in accordance with relevant process requirements. The circuit board has both the characteristics of a flexible circuit board and a rigid circuit board, and has strong practicability and wide application range. Existing composite circuit boards usually use direct lamination on the basis of flexible circuit boards, electroplating pure copper, and further opening holes in local positions of the board to expose the inner fl...

AI Technical Summary

Problems solved by technology

However, the pressing and electroplating processes generally need to be carried out many times during the production, and the pressing will cause the circuit board to deform, which will easily affect the good conduction of the lines between different layers, which will reduce the quality of the composite circuit board and make the production of the composite circuit board difficult. Low efficiency, and the use of PL and pure rubber materials in the ordinary process makes the composite circuit board after production thicker, which is difficult to meet the needs of thin circuit boards

On the other hand, since the openings in the ordinary process are drilled by laser, it is easy to have defects such as black holes, broken holes, and short blind holes, which further leads to the deterioration of the quality of the composite circuit board.

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