Front end systems and related devices integrated circuits modules and methods
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A front-end system and packaging module technology, applied in the direction of circuits, transmission systems, lighting devices, etc., can solve the problems of physical area consumption and large SiP footprint
Active Publication Date: 2018-07-10
SKYWORKS SOLUTIONS INC
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Problems solved by technology
In some SiPs, the SoC and crystal consume a relatively large amount of physical area
This creates a larger footprint for the SiP
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[0520] The following description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in many different ways, for example as defined and covered by the claims. In this specification, reference is made to the drawings, wherein like reference numbers may indicate identical or functionally similar elements. It should be understood that elements shown in the figures are not necessarily drawn to scale. Furthermore, it should be understood that certain embodiments may include more elements than shown in the figures and / or a subset of the elements shown in the figures. Furthermore, some embodiments may comprise any suitable combination of features from two or more figures. Headings are provided herein for convenience only and do not necessarily affect the scope or meaning of the claims.
[0521] Front-end system
[0522] A front-end system may be used to process signals transmitted and / or received ...
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Abstract
Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifiercircuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.
Description
[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 62 / 440,241, filed December 29, 2016, entitled "FRONT END SYSTEMS"; 2017 U.S. Provisional Patent Application No. 62 / 480,002, entitled "FRONT END SYSTEMS AND RELATED DEVICES, INTEGRATED CIRCUITS, MODULES, AND METHODS," filed March 31; U.S. Provisional Patent Application No. 62 / , entitled "FRONT END SYSTEMS AND RELATED DEVICES, INTEGRATED CIRCUITS, MODULES, AND METHODS," filed October 10, 2017, 570,549; U.S. Provisional Patent Application No., filed October 12, 2017, entitled "FRONT END SYSTEMS AND RELATED DEVICES, INTEGRATED CIRCUITS, MODULES, AND METHODS" 62 / 571,409; U.S. Provisional Patent Application No. 1, filed December 4, 2017, entitled "FRONT END SYSTEMS AND RELATED DEVICES, INTEGRATED CIRCUITS, MODULES, AND METHODS" .62 / 594,179; and U.S. Provisional Patent, filed December 7, 2017, entitled "FRONT END SYSTEMS AND RELA...
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