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Self-adaption platform for high-temperature 3D printing

A 3D printing and self-adaptive technology, applied in the field of 3D printing, can solve the problems of deformation and low forming precision, and achieve the effect of improving horizontal precision, highly integrated functions and simple structure

Active Publication Date: 2018-07-17
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the above defects or improvement needs of the prior art, the present invention provides an adaptive platform for high-temperature 3D printing. By setting the moving block and the track plate, when the forming plate is heated, the moving block moves and pulls the forming plate Thermal expansion and deformation are released to the surroundings, thereby solving the technical problem of low forming precision caused by local deformation of the formed plate after heating

Method used

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0025] An adaptive platform for high-temperature 3D printers, which can prevent the horizontal accuracy of the platform from decreasing when heated, including support plate gold 1, platform substrate 2, bottom support plate 3, glass plate 4, platform moving block 5, and moving block tank body 6 , sheet metal sheeting 9, heating film 7, forming plate 8.

[0026] The support plate is used as the ...

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Abstract

The invention belongs to the technical field of 3D printing, and discloses a self-adaption platform for high-temperature 3D printing. The self-adaption platform comprises a support plate, a platform substrate, a glass plate, movable blocks, a rail plate, a heating film and a molding plate; the platform substrate is connected with the support plate, and a spring is arranged between the two for adjusting levelness of the platform substrate; the glass plate is used as a horizontal reference of the self-adaption platform; four movable blocks are provided; each diagonal line is provided with a convex edge; the rail plate is provided with rails cooperating with the convex edges; the convex edges move along the rails to realize outward translation unfolding of the movable blocks; the molding plate is fixedly connected with the rail plate, and the heating film is arranged between the two for heating the molding plate; and after the molding plate is heated to expand, the movable blocks realizeself-adaption outward translation unfolding to shift the molding plate for outward expansion to prevent local bulge deformation of the molding plate. The heated self-adaption unfolding of the self-adaption platform is realized; the local internal bulge or warpup problem of the molding plate is solved; and the molding precision is improved.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and more specifically relates to an adaptive platform for high-temperature 3D printing. Background technique [0002] 3D printing technology, also known as additive manufacturing technology or rapid prototyping manufacturing technology (RPM for short), its basic principle is "printing layer by layer, superimposing layer by layer". 3D molding equipment, among them, Fused Deposition Modeling (FDM) equipment has become a hot spot for current applications due to its ease of use and simple operation. The core of its hardware is the hot-melt printing nozzle, and the printing materials are mostly hot-melt polymer materials. During the printing process, the materials are bonded and formed after they reach the melting point (generally, the molding temperature is above 200°C). [0003] During molding, in order to ensure the stability of the printing process, the bonding strength between the first laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/118B29C64/245B33Y30/00
CPCB33Y30/00
Inventor 单斌徐子又陈蓉胡镔邢泽华
Owner HUAZHONG UNIV OF SCI & TECH
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