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Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same

A technology of epoxy resin and composition, applied in the direction of semiconductor/solid-state device parts, semiconductor device, electric solid device, etc., can solve the curing performance or continuous formability deterioration of epoxy resin composition, welding failure, electrical failure, etc. problems, to minimize the deterioration of curing strength and continuous processability, to ensure flame retardancy, and to achieve the effect of good flame retardancy

Active Publication Date: 2018-07-17
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Soldering failures occur when semiconductor packages suffer from warpage, which can lead to electrical failures
For these reasons, the use of phosphorus-based flame retardants, which lead to increased shrinkage of epoxy resin compositions, is limited
[0005] On the other hand, although materials such as magnesium hydroxide or zinc borate have been investigated as inorganic flame retardants, these inorganic flame retardants are used in excess to ensure sufficient flame retardancy, resulting in the combination of epoxy resins for encapsulation Deterioration of curability or continuous formability of the product

Method used

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  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed using same

Examples

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Embodiment approach

[0100] Subsequently, the present invention will be described in more detail with reference to some examples. It should be understood that these examples are provided for illustration only and should not be construed as limiting the invention in any way.

[0101] Descriptions of details apparent to those skilled in the art will be omitted for clarity.

Embodiment 1 to 3 and comparative example 1 to 2

[0132] The components were weighed as shown in Table 1, and uniformly mixed using a Henschel mixer (KEUM SUNG MACHINERY CO.LTD (KSM-22)) to prepare a first powder composition. Then, each composition was melt-kneaded at 95° C. using a continuous kneader, and then cooled and pulverized, thereby preparing an epoxy resin composition for encapsulating a semiconductor device.

[0133] [Table 1]

[0134]

[0135] The epoxy resin compositions prepared in Examples 1 to 3 and Comparative Examples 1 to 5 were evaluated for fluidity, curing degree, curing shrinkage, glass transition temperature, mold release force, continuous processability and flame retardancy by the following methods sex. The measurement results are shown in Table 2.

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PUM

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Abstract

The present invention relates to an epoxy resin composition for sealing a semiconductor device, the composition containing an epoxy resin, a curing agent, an inorganic filler, and a flame retardant represented by chemical formula 1, and to a semiconductor device sealed by the same. In chemical formula 1, R is hydrogen or a C1-C20 hydrocarbon group.

Description

technical field [0001] The invention relates to an epoxy resin composition for packaging semiconductor devices and semiconductor devices packaged with the epoxy resin composition. More specifically, the present invention relates to an epoxy resin composition for encapsulating semiconductor devices, which includes a phosphorus-based flame retardant having a specific structure to minimize the shrinkage of the epoxy resin composition due to the addition of the flame retardant efficiency, curing strength, and continuous processability while ensuring good flame retardancy, and relates to semiconductor devices packaged using it. Background technique [0002] Epoxy resin compositions used for packaging semiconductor devices are generally required to have flame retardancy, especially UL94V-0 flame retardancy in the semiconductor industry. In order to ensure this level of flame retardancy, in the related art, a halogen-based flame retardant has been added to the epoxy resin composit...

Claims

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Application Information

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IPC IPC(8): C08K5/50C08K3/013C08L63/00H01L23/28
CPCC08K3/00C08K5/50C08L63/00H01L23/28
Inventor 韩承郑主泳金民兼
Owner SAMSUNG SDI CO LTD
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