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Substrate structure and manufacture thereof

A substrate and manufacturing method technology, applied in the field of substrate structure and its manufacturing method, can solve the problems of cracking in the production process and poor structural strength, and achieve the effect of avoiding cracking

Active Publication Date: 2018-07-20
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the existing substrate structure 1, due to its poor structural strength, it is easy to produce cracks in the production process

Method used

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  • Substrate structure and manufacture thereof
  • Substrate structure and manufacture thereof
  • Substrate structure and manufacture thereof

Examples

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Embodiment Construction

[0053] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...

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Abstract

The present invention provides a substrate structure, comprising: a substrate body, an insulating portion disposed on one side of the substrate body, a conductive layer disposed in the insulating portion, a conductive via hole formed in the substrate body and an electrically connected to the conductive layer, and a metal layer formed on the other side of the substrate body and electrically connected to the conductive via hole, thereby strengthening the substrate structure. The invention further provides a method for manufacturing the substrate structure as described above.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a substrate structure and a manufacturing method thereof. Background technique [0002] With the continuous innovation of electronic industry technology and the development of electronic packaging products in the direction of lightness, high efficiency, and high-density distribution, the packaging type has evolved from a plane to a three-dimensional stack, and three-dimensional integrated circuits (3D integrated circuits, 3D ICs) have become Key trends in packaging technology today. [0003] In the existing three-dimensional integrated circuit semiconductor package, a semiconductor chip is placed on a through silicon interposer (TSI for short) through a plurality of solder bumps, wherein the silicon interposer has a plurality of conductive through-silicon vias (Through Silicon Interposer). -silicon via, referred to as TSV) and a circuit redistribution layer (Redistribution layer, ref...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/48
CPCH01L21/4846H01L21/486H01L23/49816H01L23/49838H01L2224/11
Inventor 张宏宪林欣达
Owner SILICONWARE PRECISION IND CO LTD