A Vulnerability Prediction Method of Instruction SDC Based on Support Vector Regression

A technology that supports vector regression and prediction methods, applied in the direction of instruments, calculations, character and pattern recognition, etc., to achieve the effect of improving accuracy and good generalization ability
CN108334903BActive Publication Date: 2021-06-11NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Publication Date
2021-06-11

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses an instruction SDC vulnerability prediction method based on support vector regression, the steps are as follows: step 1, perform fault injection experiments on the program set, and obtain a sample data set; step 2, extract the inherent characteristics representing the nature of the instruction itself; step 3. Traversing the sample data set to generate a data propagation dependency path for the target instruction; Step 4, traversing the sample data set to calculate the error masking factor for the target instruction; Step 5, extracting the dependency features of the instruction related to the data propagation dependency; Step 6, Train the instruction SDC vulnerability prediction model based on support vector regression; step 7, extract the target program instruction features, and predict the instruction vulnerability. This method has high prediction accuracy and low performance overhead, and can be effectively applied to the prediction of instruction SDC vulnerability after the program is affected by a transient fault.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the field of soft reinforcement and trusted software, and in particular relates to a command SDC vulnerability prediction method based on support vector regression. Background technique

[0002] With the continuous development of semiconductor manufacturing technology, processors continue to reduce the size of integrated circuits and reduce the operating voltage. However, due to the reduction of the sensitivity of the device, the chip is more susceptible to the influence of space radiation while the performance of the computer is greatly improved. In the harsh radiation environment, single event effects caused by high-energy particle radiation or electromagnetic interference are the main reasons for the failure of computer systems. Single event upset (Single Event Upset, SEU) is the most important manifestation of single event effect. SEU refers to high-energy particles bombarding the device to flip its logic state, so that a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More