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A kind of 6pin dual-interface chip smart card and its preparation method

A 6PIN, dual-interface technology, applied in the field of smart cards, achieves the effect of convenient card body layout design, overcoming the coil matching problem of wire-wound antennas, and improving reliability

Active Publication Date: 2022-01-11
GIESECKE & DEVRIENT (CHINA) INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Aiming at the problems existing in the preparation of 6PIN dual-interface chip smart cards in the prior art, the invention provides a 6PIN dual-interface chip smart card and a preparation method thereof

Method used

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  • A kind of 6pin dual-interface chip smart card and its preparation method
  • A kind of 6pin dual-interface chip smart card and its preparation method
  • A kind of 6pin dual-interface chip smart card and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The 6PIN dual-interface chip smart card of the present invention comprises a 6PIN dual-interface chip module, a card body, and a wire-wound antenna. The wire-wound antenna is used to realize the solder-sealing connection between the card body and the 6PIN dual-interface chip module.

[0032] As an example, the size of the 6PIN dual-interface chip module of the 6PIN dual-interface chip smart card provided by the present invention is 8.0mm*10.62mm, and the distance between two non-contact contacts is 10.52mm.

[0033] As a better choice, the wire antenna has an M-shaped wire head (see figure 2 ), and the winding head and tail are lengthened, specifically, the lengths of the head (200) and tail (202) of the wire-wound antenna outside the chip area (204) are both 10mm-11mm. As the distance between the two non-contact contacts of the 6PIN dual-interface module becomes smaller, the existing antenna coil cannot be coupled with it for communication, and when the M-shaped wind...

Embodiment 2

[0038] The 6PIN dual-interface chip smart card of the present invention comprises a 6PIN dual-interface chip module, a card body, and a wire-wound antenna. Correspondingly, a kind of method for preparing 6PIN dual-interface chip smart card comprises the following steps:

[0039] 1. Preparation of card base

[0040] Please see attached figure 1 The step of preparing the card base includes the steps of plate making and ink adjustment, and printing and preparing the genuine substrate and the reverse substrate according to the conventional steps, and enter the next process after passing the inspection.

[0041] 2. Provide intermediate card base material

[0042] An intermediate substrate layer with a built-in wire antenna is provided, and the wire antenna has an M-shaped wire head; the lengths of the head and the tail of the wire antenna outside the chip area are both 10mm-11mm. The wire-wound antenna is used to realize the solder-sealing connection between the card body and th...

Embodiment 3

[0063] A method for preparing a 6PIN dual-interface chip, comprising the steps of:

[0064] 1. Preparation of card base

[0065] See Example 2.

[0066] 2. Provide intermediate card base material

[0067] An intermediate card base sheet with a built-in wire antenna having an M-shaped wire head is provided.

[0068] See figure 2 , the M-shaped winding head of the wire-wound antenna includes mirror-symmetrically arranged windings with a pitch of 0.4 mm, and for a single winding, it can further include various forms of winding methods, and the specific shape can be used Adjust in any desired form; the head length and tail length of the M-shaped winding head outside the chip area are 11 mm.

[0069] 3. Spot welding steps

[0070] The intermediate substrate layer with the coiled antenna coil is spot-welded and aligned with the original substrate and the reverse substrate, and then the protective film of the genuine substrate and the reverse substrate protective film are spot-...

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Abstract

The invention discloses a 6PIN dual-interface chip smart card and a preparation method thereof. The 6PIN dual-interface chip smart card includes a 6PIN dual-interface chip module, a card body, and a wire-wound antenna, and the wire-wound antenna is used to realize the card body. The sealing connection with the 6PIN dual-interface chip module is characterized in that: the wire-wound antenna has an M-shaped wire head, and the head of the wire-wound antenna is connected between the 6PIN dual-interface chip module and the card The length between the bodies is 10mm-11mm; the length of the tail of the wire-wound antenna between the 6PIN dual-interface chip module and the card body is 10mm-11mm. The chip module size of the 6PIN dual-interface chip smart card provided by the invention is 8.0mm*10.62mm, the area of ​​the chip module is reduced, the cost is reduced, and it is more convenient for customers to carry out card body layout design; the method for preparing the chip smart card provided by the invention solves the problem of When the temperature is too high during tinning, the reliability of the module is reduced, and the quality of the prepared product is stable and reliable.

Description

technical field [0001] The invention belongs to the field of smart cards, and in particular relates to a 6PIN dual-interface chip smart card based on a wire-wound antenna welding process and a preparation method thereof. Background technique [0002] There is a market demand for chip modules in the industry that are gradually becoming smaller. It is a trend in the field of smart cards to develop 6PIN dual-interface chip modules in line with market development trends and to replace traditional smart cards. [0003] The size of the traditional 8PIN dual-interface (DI) module is 11.4mm*12.6mm, and its processing technology is lead-free soldering method. This soldering method has the characteristics of long service life and stable process, but the area of ​​8PINDI is large and the cost is high. Reduced the available area for the customer's card surface element design. [0004] However, the size of the new 6PIN dual-interface module is 8.0mm*10.62mm, and there are matching probl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/0772G06K19/07779
Inventor 阮家祺贺瑞粉钟旭峰
Owner GIESECKE & DEVRIENT (CHINA) INFORMATION TECH CO LTD