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Heat exchanger and refrigeration cycle device

A technology of heat exchangers and refrigerants, applied in the direction of heat exchange equipment, heat exchange materials, heating and refrigeration combinations, etc., can solve problems such as refrigerant disproportionation reaction

Active Publication Date: 2018-08-07
FUJITSU GENERAL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rise in pressure and temperature may cause the disproportionation reaction of HFO1123 refrigerant

Method used

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  • Heat exchanger and refrigeration cycle device
  • Heat exchanger and refrigeration cycle device
  • Heat exchanger and refrigeration cycle device

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Experimental program
Comparison scheme
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Embodiment Construction

[0016] In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown schematically in order to simplify the drawings.

[0017] Hereinafter, embodiments of the heat exchanger disclosed in the present invention will be described in detail based on the drawings. In addition, the following embodiment does not limit the heat exchanger disclosed by this invention.

[0018] The structure of the refrigeration cycle device

[0019] figure 1 The refrigerant circuit of the refrigeration cycle apparatus of this embodiment is shown. The refrigeration cycle device 1 is suitable for an air conditioning device that cools and heats a room. like figure 1 As shown, the refrigeration cycle apparatus 1 inc...

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PUM

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Abstract

A heat exchanger includes: a heat transfer pipe in which refrigerant flows; and a spiral groove formed at an inner peripheral surface of the heat transfer pipe. A height of an inner wall of the groovein a radial direction of the heat transfer pipe is equal to or greater than 0.1 [mm], and when a wetted edge length of the heat transfer pipe is S, an inclination angle between a pipe axis directionof the heat transfer pipe and a longitudinal direction of the groove in a section of the heat transfer pipe parallel with the pipe axis direction is [theta], and a length of the heat transfer pipe isL, the inclination angle [theta] is an acute angle, and a wetted area S*L / cos[theta] of the heat transfer pipe satisfies S*L / cos[theta] >= 0.5 m<2>.

Description

technical field [0001] The invention relates to a heat exchanger and a refrigeration cycle device. Background technique [0002] The refrigeration cycle device includes a compressor, a condenser, an expansion valve (pressure reducer), and an evaporator, and circulates the refrigerant in a closed refrigerant circuit. As the refrigerant, R410A refrigerant which is a hydrofluorocarbon (HFC) is widely used. However, the R410A refrigerant has a large global warming potential (GWP: Global Warming Potential). Therefore, in the known related art, as a refrigerant having a small GWP, a hydrofluoroolefin (HFO) 1123 refrigerant, and a mixed refrigerant containing the HFO 1123 refrigerant are used. [0003] In addition, technology in this field is disclosed in, for example, International Publication No. 2012 / 157764. [0004] However, HFO1123 refrigerant has the property of causing a disproportionation reaction represented by the following chemical reaction formula under predetermined...

Claims

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Application Information

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IPC IPC(8): F25B13/00F25B29/00F25B41/06F25B41/30
CPCF25B13/00F25B29/003F25B41/30F28F13/187C09K5/045F28F1/40F24F1/14F24F1/26F25B9/002F25B39/04F28D7/082F28F2210/06
Inventor 板仓俊二堀口贤藤利行岛田宗太船田和也小峰健治田中顺也
Owner FUJITSU GENERAL LTD