Manufacturing method of array substrate, array substrate and display device
A technology of an array substrate and a manufacturing method, applied in the display field, can solve problems such as the efficiency of buffer layer shedding and cutting, and achieve the effects of improving efficiency, improving control accuracy, and reducing the risk of detachment
Active Publication Date: 2020-05-26
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0005] The present application provides a method for manufacturing an array substrate, an array substrate and a display device, which can solve the existing problem that the buffer layer may fall off when cutting the array substrate and the problem of low cutting efficiency
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[0047] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
[0048] Please refer to figure 1 , figure 1 It is a schematic structural diagram of an array substrate provided by the related art. The array substrate may include: a base substrate 00, on which are sequentially arranged a buffer layer 01, an active layer pattern 02, a gate insulating layer 03, a gate electrode The pattern 04, the interlayer dielectric layer 05, the source and drain patterns 06, the flat layer 07 and the passivation layer 08, the interlayer dielectric layer 05, the flat layer 07 and the passivation layer 08 all need to be formed by a patterning process. After the patterning process, the corresponding film layer structure in the area to be cut in the array substrate can be removed. The interlayer dielectric layer 05 is provid...
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Abstract
The invention discloses an array substrate manufacturing method, an array substrate and a display device and belongs to the display technology field. The method comprises steps that a buffer layer anda film transistor are formed on a base substrate, the film transistor comprises an active layer pattern, the buffer layer is provided with a first through hole, wherein the active layer pattern and the first through hole of the buffer layer are formed through the one-time picture composition process, and the to-be-cut area of the array substrate is located in the front projection area of the first through hole at the base substrate. The active layer pattern and the first through hole are formed through the one-time picture composition process and the to-be-cut area of the array substrate is located in the front projection area of the first through hole at the base substrate, so the buffer layer in the to-be-cut area can be eliminated. The method is used for manufacturing the array substrate.
Description
technical field [0001] The present invention relates to the field of display technology, and in particular, to a manufacturing method of an array substrate, an array substrate and a display device. Background technique [0002] With the development of display technology, various products with display function appear in daily life, such as mobile phones, tablet computers, TV sets, notebook computers, digital photo frames and navigators, etc. All these products need to be equipped with displays without exception . [0003] For example, the display may include: an array substrate, a color filter substrate, and a liquid crystal layer between the array substrate and the color filter substrate. Usually, after the array substrate is fabricated, the array substrate needs to be cut so that the cut array substrate The size requirements of the final manufactured display can be met. [0004] In the current array substrate, a film layer structure needs to be set. The film layer structu...
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IPC IPC(8): H01L21/027
CPCH01L21/0275
Inventor 乔赟李付强赵生伟蔡志光方业周王珍史大为杨璐张寒王争奎丛乐乐秦文文黄飞
Owner BOE TECH GRP CO LTD