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Rotary heating mechanism realizing taking-placing and precise positioning of wafers and MASK

A technology of precise positioning and rotating heating, applied in ion implantation plating, gaseous chemical plating, coating, etc., can solve problems such as uneven heating and product quality problems, and achieve the effect of ensuring consistency

Pending Publication Date: 2018-08-10
成都华聚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing production equipment, not only is it difficult to achieve precise positioning of the wafer and MASK, but also uneven heating may easily cause product quality problems

Method used

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  • Rotary heating mechanism realizing taking-placing and precise positioning of wafers and MASK
  • Rotary heating mechanism realizing taking-placing and precise positioning of wafers and MASK
  • Rotary heating mechanism realizing taking-placing and precise positioning of wafers and MASK

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as Figure 1 to Figure 3 As shown, a rotating heating mechanism for realizing wafer and MASK pick-and-place and precise positioning includes a double-layer lifting mechanism 1, a wafer positioning drum 2, a heating device 3, a rotating mechanism 4 and a positioning mechanism 5, and the inside of the rotating mechanism 5 It adopts internal gear transmission, and the shaft is driven by a servo motor 17 through a magnetic fluid seal. It can rotate forward and reverse, and the speed is adjustable. The vacuum leakage rate is less than 1×10-9Pam3 / s. The top of the rotating mechanism 4 is provided with a top flange 15 , the bottom is provided with a bottom flange 16, the positioning mechanism 5 is installed on the bottom flange 17 of the rotating mechanism 4, the positioning mechanism 5 includes a driving cylinder 6 and a positioning shaft 7, the driving cylinder 6 is connected with the positioning shaft 7 through a connecting seat 8, and the driving The cylinder shaft of...

Embodiment 2

[0027] Such as Figure 1 to Figure 3 As shown, a rotating heating mechanism for realizing wafer and MASK pick-and-place and precise positioning includes a double-layer lifting mechanism 1, a wafer positioning drum 2, a heating device 3, a rotating mechanism 4 and a positioning mechanism 5, and the inside of the rotating mechanism 5 It adopts internal gear transmission, and the shaft is driven by a servo motor 17 through a magnetic fluid seal. It can rotate forward and reverse, and the speed is adjustable. The vacuum leakage rate is less than 1×10-9Pam3 / s. The top of the rotating mechanism 4 is provided with a top flange 15 , the bottom is provided with a bottom flange 16, the positioning mechanism 5 is installed on the bottom flange 17 of the rotating mechanism 4, the positioning mechanism 5 includes a driving cylinder 6 and a positioning shaft 7, the driving cylinder 6 is connected with the positioning shaft 7 through a connecting seat 8, and the driving The cylinder shaft of...

Embodiment 3

[0030] Such as Figure 1 to Figure 3 As shown, a rotating heating mechanism for realizing wafer and MASK pick-and-place and precise positioning includes a double-layer lifting mechanism 1, a wafer positioning drum 2, a heating device 3, a rotating mechanism 4 and a positioning mechanism 5, and the inside of the rotating mechanism 5 It adopts internal gear transmission, and the shaft is driven by a servo motor 17 through a magnetic fluid seal. It can rotate forward and reverse, and the speed is adjustable. The vacuum leakage rate is less than 1×10-9Pam3 / s. The top of the rotating mechanism 4 is provided with a top flange 15 , the bottom is provided with a bottom flange 16, the positioning mechanism 5 is installed on the bottom flange 17 of the rotating mechanism 4, the positioning mechanism 5 includes a driving cylinder 6 and a positioning shaft 7, the driving cylinder 6 is connected with the positioning shaft 7 through a connecting seat 8, and the driving The cylinder shaft of...

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PUM

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Abstract

The invention discloses a rotary heating mechanism realizing taking-placing and precise positioning of wafers and MASK. The rotary heating mechanism comprises a double-layer lifting mechanism, a waferpositioning rotary barrel, a heating device, a rotating mechanism and a positioning mechanism. The positioning mechanism is mounted at the bottom of the rotating mechanism, the wafer positioning rotary barrel is mounted at the top of the rotating mechanism, and the heating device is mounted in the wafer positioning rotary barrel. The double-layer lifting mechanism is arranged above the wafer positioning rotary barrel, and the bottom of the double-layer lifting mechanism is fixedly connected with the top end of the rotating mechanism. Rotation, heating, taking-placing of the wafers and the MASK, precise positioning of the wafers and the MASK and other functions are integrated in the rotary heating mechanism, so that the automatic and precise positioning function of the wafers and the MASKis realized.

Description

technical field [0001] The invention belongs to the technical field of semiconductor production equipment, and in particular relates to a rotating heating mechanism for realizing pick-and-place and precise positioning of wafers and MASKs. Background technique [0002] In semiconductor PVD and CVD processes, it is often necessary to place MASKs (masks) of different shapes above the wafer in a vacuum environment, and deposit specific functional films on the surface of the wafer through specific patterns on the MASK. In order to ensure the accuracy of the film, the wafer and MASK must be positioned precisely. At the same time, in order to improve the quality and uniformity of the film thickness, the wafer needs to be heated at high temperature and rotated at a constant speed during the coating process. However, in the existing production equipment, not only is it difficult to achieve precise positioning of the wafer and MASK, but also uneven heating may easily cause product qua...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C14/04C23C14/22C23C16/04C23C16/458C23C16/46
CPCC23C14/042C23C14/22C23C14/505C23C16/042C23C16/4581C23C16/46
Inventor 潘明元陈新祝家太
Owner 成都华聚科技有限公司