High-drawability low-peak ultrathin copper foil shiny surface microetching treatment process and equipment

Abstract

The invention discloses a high-drawability low-peak ultrathin copper foil shiny surface microetching treatment process and equipment. The process comprises the three steps of microetching, water washing and drying, wherein in the microetching step, carrier ultrathin copper foil is immersed into a microetching tank for surface electro-deposition microetching; side supports are arranged on the leftside of the microetching tank and the right side of a drying tank; a cross rod is stretched over between the two side supports; a transverse driving mechanism is mounted on the cross rod; a telescopicdevice is mounted on the lower side of the transverse driving mechanism; an electric fixture capable of clamping the carrier ultrathin copper foil is mounted at the lower end of the telescopic device. Through the high-drawability low-peak ultrathin copper foil shiny surface microetching treatment process and equipment, the microetching effect is improved, the stability of the ultrathin copper foil is enhanced, and the production process is friendlier to environment.

Description

technical field [0001] The invention relates to the technical field of ultra-thin copper foil surface treatment, in particular to a smooth surface micro-etching treatment process and equipment for high-elongation and low-peak ultra-thin copper foil. Background technique [0002] Ultra-thin copper foil refers to copper foil for printed circuit boards with a thickness of 9 μm or less (also known as ultra-thin copper foil). Due to the difficulty in handling ultra-thin copper foil, it is generally compounded with a carrier as a support. The types of carriers include metal foil (copper foil, aluminum foil), organic film, and the like. Since most of its current product forms are thin copper foil with a carrier, it is called copper foil with a carrier (carrier copper foil) in some documents. Ultra-thin copper foil for PCB is generally produced by electrolysis or calendering, and the majority of copper foils are produced by electrolysis. Both ultra-thin electrolytic copper foil a...

AI Technical Summary

Problems solved by technology

With the development of miniaturization of electronic products, the thickness of copper foil is getting thinner and thinner, and the etching of printed circuit boards is getting thinner. The surface of the foil is easily oxidized, which affects the subsequent pressing and peeling. It is necessary to carry out proper surface treatment on the ultra-thin copper foil. It is no longer suitable for ultra-thin copper foil surface treatment, and a better treatment process must be developed

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