ESD protection diode-integrated shielding gate trench MOSFET device and manufacturing method thereof

A technology of ESD protection and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, diodes, electric solid-state devices, etc., to achieve the effects of superior device performance, reduced leakage current, and reduced manufacturing complexity and cost

Inactive Publication Date: 2018-08-10
CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the prior art described above, the object of the present invention is to provide a shielded gate trench MOSFET device with integr

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • ESD protection diode-integrated shielding gate trench MOSFET device and manufacturing method thereof
  • ESD protection diode-integrated shielding gate trench MOSFET device and manufacturing method thereof
  • ESD protection diode-integrated shielding gate trench MOSFET device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0080] The following describes the implementation of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and the features in the embodiments can be combined with each other if there is no conflict.

[0081] It should be noted that the illustrations provided in the following embodiments only illustrate the basic idea of ​​the present invention in a schematic manner. The figures only show the components related to the present invention instead of the number, shape, and number of components in actual i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an ESD protection diode-integrated shielding gate trench MOSFET device and a manufacturing method thereof. The device comprises a semiconductor substrate, an epitaxial layer positioned on the semiconductor substrate, a first trench, a second trench and a third trench formed in the epitaxial layer and arranged in sequence, a shielding electrode filled in the second trench andon the lower parts of the first trench and the third trench, an insulating isolation layer for coating the shielding electrode, a gate electrode and a gate dielectric layer for filling the upper partof the first trench, an ESD protection diode arranged on the upper part of the third trench, a body region positioned on the upper part of the epitaxial layer, a source region positioned on the bodyregion, and a drain region arranged below the semiconductor substrate, wherein source end metal is electrically connected with the source region, the body region, the shielding electrode and one end of the ESD protection diode; and the gate end metal is connected with the gate electrode and the other end of the ESD protection diode. The device is compact in structure and excellent in performance,and the realization method is simple, so that the electric leakage of the ESD protection diode can be lowered, and the anti-ESD impact capability of the MOSFET gate is improved.

Description

technical field [0001] The invention relates to the field of design and manufacture of semiconductor power devices, in particular to the device structure and manufacturing method of a shielded gate trench power MOSFET. Background technique [0002] In the field of medium and low voltage power MOSFETs, the performance of shielded gate trench power MOSFETs is significantly better than that of trench power MOSFETs and planar power MOSFETs, because the shielding electrode greatly reduces the gate-drain capacitance (Cgd), and because the shielding electrode acts as a The field plate (Field Plate) effect makes it possible to use a higher doping concentration to achieve the same device withstand voltage (BVDSS), thereby reducing the on-resistance (Rdson), that is, the shielded gate trench MOSFET device can simultaneously achieve low On-resistance (Rdson) and low gate-to-drain capacitance (Cgd). In general power transmission or conversion systems, low on-resistance (Rdson) means lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L27/02H01L29/78H01L29/423H01L21/8249
CPCH01L21/8249H01L27/0255H01L29/4236H01L29/7827
Inventor 焦伟余强姚鑫桑雨果骆菲
Owner CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products