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Turnover chip batch positioning device

A positioning device and flip-type technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in meeting batch repairs and low work efficiency, achieve batch positioning and repairs, improve work efficiency, and avoid drop effect

Inactive Publication Date: 2018-08-14
湖州靖源信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing positioning relies on manual placement one by one, resulting in low work efficiency and difficult to meet the needs of batch repairs

Method used

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  • Turnover chip batch positioning device
  • Turnover chip batch positioning device
  • Turnover chip batch positioning device

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Experimental program
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Embodiment Construction

[0020] The embodiments involved in the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0021] combine Figure 1 to Figure 5 , a flip-type chip batch positioning device, including a console 1, a control module is provided in the console 1, a power switch 26 and a buzzer 27 are arranged on one side of the console 1, and the power switch 26 is close to the side of the console 1 Front, the back of the console 1 is provided with a power cord 28, the top of the console 1 is provided with a fixed bracket 2, the fixed bracket 2 is a U-shaped structure, the transverse part of the fixed bracket 2 is located on the upper surface of the console 1, and the fixed bracket 2 One end of the horizontal portion is provided with a first driving motor 3, and the first drive shaft 5 of the first driving motor 3 runs through a vertical portion of the fixed bracket 2 and stretches out of the fixed bracket 2, and the other end of the horizon...

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Abstract

The invention provides a turnover chip batch positioning device. The device comprises a console, a control module is arranged in the console, a power switch and a buzzer are arranged on a lateral of the console; the power switch is close to the front of the console, a power line is arranged on the back of the console, a fixed bracket is arranged at the top of the console, and the fixed bracket isa U-shaped structure. A positioning plate is fixedly arranged on the adsorption table, and a transparent cover is hermetically connected with a positioning plate in a relative firm way; chips are positioned through positioning slots in array on the positioning plate, the chip is adsorbed and positioned by a vacuum sucker in the adsorption table when the front is downward, and other chips overturnand slide in the transparent cover under the synchronous driving of a first driving motor and a second driving motor, thereby quickly falling in the positioning slots to be adsorbed and positioned bythe vacuum sucker. The positioning device provided by the invention is high in working efficiency, and satisfies the demands of batch positioning and repairing of the chips.

Description

technical field [0001] The invention relates to the technical field of chip maintenance equipment, in particular to a flip-type chip batch positioning device. Background technique [0002] In the process of surface mount technology (SMT) production and processing, due to factors such as poor printing and patch placement, chip welding defects appear, and this phenomenon is common in various factories. Ball array package (BGA) chips are basically expensive chips such as central processing unit (CPU), flash memory (Flash), power management, etc. The price is tens, hundreds or even thousands, and it is indispensable on the circuit board of electronic products. of. Due to the high price, defective chips caused by welding must be repaired and reused. In the rework and reuse of BGA chips, it is first necessary to locate the BGA chips in batches, so as to facilitate batch soldering of the BGA chips. However, the existing positioning relies on manual placement one by one, which le...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/683
CPCH01L21/68H01L21/6838
Inventor 王淑琴
Owner 湖州靖源信息技术有限公司
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