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Novel laser cutting processing device

A laser cutting and processing device technology, which is applied in the field of sheet metal processing, can solve the problems of increasing processing costs, affecting the accuracy of secondary processing, and affecting the accuracy of processing, and achieves the effects of increasing service life, ensuring quality control, and preventing displacement

Inactive Publication Date: 2018-08-24
YIWU JINGKAI MACHINERY EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, laser cutting is a technological revolution in sheet metal processing and the core technology in sheet metal processing. Laser cutting machines have high flexibility, fast cutting speed, high production efficiency, and short product production cycles, which have won a wide range of markets for customers. In the laser cutting process, the maximum size, material, maximum thickness to be cut, and the size of the raw material format should be considered during the laser cutting process. However, the current laser cutting machines on the market place the workpiece on the workbench and cut it. After penetrating the workpiece, damage will be formed on the surface of the workbench, affecting the accuracy of secondary processing, and greatly reducing the service life of the workbench and increasing the processing cost. Moreover, the workpiece is prone to displacement without clamping. Affects the precision of processing, making it difficult to effectively control the quality during processing

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see Figure 1-5 , an embodiment provided by the present invention: a new type of laser cutting processing device, including a horizontal workbench 1, a sliding space 2 is arranged inside the horizontal workbench 1, and the left and right ends of the upper end wall of the sliding space 2 are symmetrical A sliding groove 3 is provided, and the sliding groove 3 communicates with the sliding space 2 and the external space. The sliding space 2 is provided wi...

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Abstract

The invention discloses a novel laser cutting processing device. The novel laser cutting processing device comprises a horizontal workbench. The horizontal workbench is internally provided with a sliding space. The sliding space is internally provided with a sliding bottom plate. The left end and the right end of the upper end face of the sliding bottom plate are symmetrically provided with supporting rods. The upper ends of the supporting rods are fixedly connected through a cross bar. A bar body of the cross bar is sleeved with a transverse moving device. The lower end of the transverse moving device is fixedly connected with a lifting cutting device. The middle position of the upper end face of the workbench is provided with a plurality of spirally-ascending mechanisms which are evenlydistributed and four same spirally-ascending screws which are used in cooperation with the spirally-ascending mechanisms. When the novel laser cutting processing device works, the situation that laserpenetrates a workpiece and then damages the workbench can be effectively prevented, and the service life of the workbench is prolonged; and a clamping structure is formed through a pressing spacer and a round supporting plate, the situation that the workpiece moves in the processing, and blank waste is caused by processing failures is prevented, and by means of cooperation of a rolling wheel anda rolling groove, the friction coefficient can be reduced.

Description

technical field [0001] The invention relates to the field of sheet metal processing, in particular to a novel laser cutting processing device. Background technique [0002] At present, laser cutting is a technological revolution in sheet metal processing and the core technology in sheet metal processing. Laser cutting machines have high flexibility, fast cutting speed, high production efficiency, and short product production cycles, which have won a wide range of markets for customers. In the laser cutting process, the maximum size, material, maximum thickness to be cut, and the size of the raw material format should be considered during the laser cutting process. However, the current laser cutting machines on the market place the workpiece on the workbench and cut it. After penetrating the workpiece, damage will be formed on the surface of the workbench, affecting the accuracy of secondary processing, and greatly reducing the service life of the workbench and increasing the...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/70
Inventor 马浩晓
Owner YIWU JINGKAI MACHINERY EQUIP