Lossless and clean transferring method for high-precision large-caliber ultrathin elements

Abstract

The invention discloses a lossless and clean transferring method for high-precision large-caliber ultrathin elements. The lossless and clean transferring method for the high-precision large-caliber ultrathin elements comprises the following steps of (S1) fixing elements; and after cleaning the elements, loading the elements into a special support frame in a dust-free plant, and fixing the elements; (S2) inspecting the elements: enabling the elements and the support frame to enter an inspection flow, and starting to package after the inspection is pass; and (S3) packaging and sealing the elements. According to the lossless and clean transferring method for the high-precision large-caliber ultrathin elements, after the elements are processed, the large-caliber ultrathin elements can be stored and transferred in a lossless and clean way, and the complete-flow lossless and clean close loop of the elements is realized during a process from discharging to loading.

Description

technical field [0001] The invention relates to non-metal precision manufacturing and is mainly used in the technical field of ultra-strong, ultra-short and high-power lasers. In particular, it relates to a non-destructive and clean transfer method for ultra-thin components with high precision and large diameter. Background technique [0002] The high-precision optical components used in the field of strong lasers have very strict requirements on them. Not only the surface processing accuracy is very high, but after the processing is completed, the surface of the components cannot be processed during the shipment, storage, installation and use of the components. Touch, so as not to damage the surface of the component. In addition, after the processing of the component, the surface of the component needs to maintain a 50-level clean surface during the process of transportation and storage. The method meets the requirement that the surface of the component is not damaged and ...

AI Technical Summary

Problems solved by technology

Thin and fragile, the traditional single-piece packaging clamping method is only suitable for components with a diameter-to-thickness ratio of 1:50. When used on such ultra-thin components, the costs of packaging fixtures, storage space, and logistics space are greatly wasted

At the same time, the surface cleanliness of the components cannot be guaranteed, and the components are deformed. For this reason, a method is considered to solve the above problems fundamentally.

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