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Self-heating phase-change storage unit and self-heating phase-change storage structure

A phase-change storage and self-heating technology, applied in electrical components and other directions, can solve the problems of high power consumption of phase-change memory, easy thermal interference of phase-change memory cells, etc., to avoid thermal interference, low power consumption, and long service life Effect

Inactive Publication Date: 2018-08-28
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the object of the present invention is to provide a self-heating phase-change memory unit and a self-heating phase-change memory structure, which are used to solve the problem of high power consumption of the phase-change memory in the prior art, adjacent Problems such as thermal interference are easily generated between the phase change memory cells

Method used

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Embodiment 2

[0044] like Figure 7 As shown, the present invention also provides a self-heating phase-change memory structure, the self-heating phase-change memory structure includes at least one stacked structure, and the stacked structure includes at least one self-heating phase as described in Embodiment 1 Change storage unit 1. In order to expand the storage capacity of the self-heating phase-change memory structure, the stacked structure usually includes a plurality of self-heating phase-change memory cells 1 stacked in sequence, wherein one of the self-heating phase-change memory cells 1 The phase-change storage medium 12 is in contact with the self-heating electrode 11 in another self-heating phase-change storage unit 1 adjacent thereto. In this embodiment, the self-heating phase-change memory structure includes two stacked structures, and the two stacked structures are arranged side by side and are provided with an isolation material, such as an insulating material, between them. ...

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Abstract

The invention provides a self-heating phase-change storage unit and a self-heating phase-change storage structure. The self-heating phase-change memory unit includes a self-heating electrode and a phase-change storage medium connected with the self-heating electrode; the self-heating electrode comprises at least one self-heating material layer; the phase-change storage medium comprises at least one layer phase-change storage material layer; the self-heating material layer and the phase-change storage material layer are made of different materials; and the self-heating material layer and the phase-change storage material layer each comprise at least one chalcogen element. The self-heating phase-change storage unit of the invention has fast data writing capability and a low-power consumptioncharacteristic; and thermal interference between adjacent self-heating phase-change storage units can be effectively avoided. The self-heating phase-change structure of the invention has the advantages of very high data writing speed, strong data retention capability, low power consumption, long service life and the like.

Description

technical field [0001] The invention relates to the field of semiconductor materials and semiconductor devices, in particular to a self-heating phase-change storage unit and a self-heating phase-change storage structure. Background technique [0002] Phase change memory (PCRAM) is a non-volatile memory device. Its basic principle is to use chalcogenide as the storage medium, and use electric energy (heat) to make the storage medium convert between crystalline state (low resistance) and amorphous state (high resistance) so as to realize the writing and erasing of information. Specifically, information is read by measuring the resistance of the storage medium and comparing whether it is a high resistance "1" or a low resistance "0". Since the phase change memory does not need to erase the previous code or data before writing the updated code, its speed has advantages over traditional NAND, and the read and write time is relatively balanced, and the phase change memory does no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L45/00
CPCH10N70/841H10N70/882H10N70/231
Inventor 沈佳斌朱敏任堃吕士龙宋志棠
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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