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Flexible composite electrode structure and manufacturing method thereof, flexible electronic device

A composite electrode and manufacturing method technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of unsatisfactory stability and service life of flexible electronic devices, and achieve the goal of improving reliability and stability and prolonging service life Effect

Active Publication Date: 2021-09-17
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the study found that the stability and lifetime of these flexible electronic devices are not ideal

Method used

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  • Flexible composite electrode structure and manufacturing method thereof, flexible electronic device
  • Flexible composite electrode structure and manufacturing method thereof, flexible electronic device
  • Flexible composite electrode structure and manufacturing method thereof, flexible electronic device

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Embodiment Construction

[0026] The inventors found that in reliability analysis of flexible electronic devices, the stability and lifetime of metal electrodes are important factors. This is because flexible electronic devices can be bent, and during the bending process, the metal electrodes are subjected to tensile stress or compressive stress depending on the bending direction. When the stress accumulates to a certain level, cracks will appear in the metal electrode, resulting in the deterioration of the conductivity of the electrode, or even an open circuit. Moreover, the macroscopic cracks of the electrode will also affect the performance of the connected device functional layer and reduce the reliability and stability of the flexible electronic device.

[0027] In view of the above problems, the inventors have further studied and found that, from the perspective of microscopic mechanism, the macroscopic cracks shown by the metal electrodes are nanoscale microcracks at the beginning of the plastic...

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Abstract

The invention provides a flexible composite electrode structure and its manufacturing method, and a flexible electronic device. An m-layer repair layer and an n-layer conductive layer are formed on a flexible substrate, the repair layer and the conductive layer are alternately formed, and the repair The thicknesses of the conductive layer and the conductive layer are both on the nanometer level, and the repair layer is made of a conductive material capable of automatically repairing nano-cracks, wherein, n is a positive integer greater than or equal to 2, m=n+1, that is, in the A repair layer is provided between the flexible substrate and the conductive layer, between multiple layers of the conductive layer, and between the conductive layer and the external device. When the flexible electrode composite structure is damaged and produces nano-cracks, the The repair layer can automatically repair nano cracks and prevent the nano cracks from aggravating to generate macro cracks, thereby improving the reliability and stability of the flexible composite electrode structure and prolonging the service life.

Description

technical field [0001] The invention relates to a flexible composite electrode structure, a manufacturing method thereof, and a flexible electronic device. Background technique [0002] Flexible electronic devices are the core devices of wearable electronic devices, and their performance stability and lifespan directly affect the reliability of wearable electronic devices. For traditional flexible electronic devices, organic field effect transistors are taken as an example, and its electrodes include source, drain, gate and substrate electrodes. According to the different positions of the electrodes, it can be divided into four structures: bottom gate top contact, bottom gate bottom contact, top gate top contact and top gate bottom contact. Flexible electronic devices use metals such as Cu (copper) or Al (aluminum) as the mainstream electrode materials. However, studies have found that the stability and lifetime of these flexible electronic devices are not ideal. Content...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/10H01L51/40
CPCH10K71/60H10K10/82
Inventor 唐莹袁骁霖王乾斌张大华
Owner NINGBO SEMICON INT CORP