Backing substrate, fabrication method and equipment of backing substrate, display substrate and display device
A technology of a substrate substrate and a manufacturing method, which is applied in glass manufacturing equipment, manufacturing tools, semiconductor/solid-state device manufacturing, etc., can solve the problem of increasing the thickness of TFT-LCD, damage to the functional film layer of the display substrate, and difficulty in exporting the electrostatic charge of the array substrate. and other problems to achieve the effect of protecting the service life
Inactive Publication Date: 2018-09-04
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0003] However, since the outer surface of the display substrate is generally made of insulating glass, it is difficult to extract the electrostatic charge generated on the outer surface of the array substrate and the outer surface of the color filter substrate, which will cause damage to the functional film layer of the display substrate.
[0004] For this reason, a conductive film layer is generally attached to the outer surface of the display substrate to discharge the generated static electricity, but this also increases the complexity of TFT-LCD fabrication and increases the thickness of TFT-LCD.
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[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0038] see figure 1 The substrate 1 provided by the embodiment of the present invention includes a first substrate material layer 11 and an antistatic layer, and the first substrate material layer 11 and the antistatic layer are stacked. When making the base substrate 1, the base substrate 1 can be produced by the melt overflow method, but it should be noted that, considering that the molecular movement is relatively active in the molten state, the antistatic layer...
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The invention discloses a backing substrate, a fabrication method and equipment of the backing substrate, a display substrate and a display device and relates to the technical field of display. The influence of static electricity generated by the backing substrate on a service life of the display device is reduced on the premise that the thickness of the display device is not increased. The backing substrate comprises a first backing material layer and an anti-static layer, wherein the first backing material layer and the anti-static layer are arranged in a laminated manner. The fabrication equipment of the backing substrate is used for fabricating the backing substrate and comprises a first flow division pipeline and a second flow division pipeline that communicate with a substrate formation unit. The backing substrate, the fabrication method and the equipment of the backing substrate, the display substrate and the display device are used for a display technology.
Description
technical field [0001] The present invention relates to the field of display technology, in particular to a base substrate, a manufacturing method, equipment, a display substrate and a display device. Background technique [0002] The existing Thin Film Transistor Liquid Crystal Display (TFT-LCD for short) mainly includes an array substrate and a color filter substrate. Or the frictional contact of the machine table will cause static electricity to be generated on the outer surface of the array substrate and the outer surface of the color filter substrate. [0003] However, since the outer surface of the display substrate is generally made of insulating glass, it is difficult to extract the electrostatic charge generated on the outer surface of the array substrate and the outer surface of the color filter substrate, which will cause damage to the functional film layer of the display substrate. . [0004] For this reason, a conductive film layer is generally attached to the...
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IPC IPC(8): H01L27/12H01L23/60H01L21/77G02F1/1362
CPCH01L23/60H01L27/1218H01L27/1262G02F1/136204G02F2202/22C03B17/064C03B17/02Y02P40/57G02F1/133514
Inventor 秦卫杜永刚王祥臻吴斌徐国华
Owner BOE TECH GRP CO LTD