Novel semiconductor material production technological equipment

A production technology, semiconductor technology, applied in metal processing and other directions, can solve problems such as safety hazards, and achieve the effects of increasing stability, improving drilling safety, and simple structure

Inactive Publication Date: 2018-09-07
黄宝超
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Semiconductor materials are widely used in modern industrial production. Semiconductor materials need to be drilled during processing and production. However, in traditional semiconductor material drilling devices, the drill bit is often exposed during the drilling operation, and the drill bit will also Being touched by the operator, therefore, there is a great potential safety hazard in the traditional semiconductor material drilling device

Method used

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  • Novel semiconductor material production technological equipment
  • Novel semiconductor material production technological equipment

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Embodiment Construction

[0019] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0020] Any feature disclosed in this specification, unless specifically stated, can be replaced by other alternative features that are equivalent or have similar purposes. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0021] Such as Figure 1-2 As shown, a new type of semiconductor material production technology equipment of the device of the present invention includes a stand 10, and the inner bottom of the stand 10 is provided with a counterweight groove 101 with an opening facing downward, and a counterweight groove 101 is fixedly installed in the counterweight groove 101. Weight 102, the stable shape of the frame 10 can be increased by the counterweight 102, the frame is provided with a cavity 11 with a notch ...

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PUM

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Abstract

The invention discloses novel semiconductor material production technological equipment. The equipment comprises a frame base. The frame base is provided with a containing cavity with a rightward opening. The top wall of the containing cavity is provided with a first sliding groove with a downward opening. A first sliding block capable of sliding up and down is mounted in the first sliding groove.The first sliding groove is provided with a second sliding groove with an upward opening. The bottom wall of the second sliding groove is provided with a through cavity communicating with the outside. A second sliding block and a third sliding block located below the second sliding block are slidably mounted in the second sliding groove. The second sliding block is rotatably provided with a drillrod extending downwards. The lower end of the drill rod penetrates through the third sliding block and is rotatably matched with the third sliding block through a bearing. The lower end of the drillrod is provided with a drill bit extending into the through cavity.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a new type of semiconductor material production technology equipment. Background technique [0002] Semiconductor materials are widely used in modern industrial production. Semiconductor materials need to be drilled during processing and production. However, in traditional semiconductor material drilling devices, the drill bit is often exposed during the drilling operation, and the drill bit will also Being touched by the operator, therefore, there is a great potential safety hazard in the traditional semiconductor material drilling device. Contents of the invention [0003] Aiming at the deficiencies of the above technologies, the present invention proposes a new type of semiconductor material production technology equipment. [0004] A new type of semiconductor material production technology equipment of the device of the present invention, comprising a fra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/16B26D7/02B26D5/08B26D5/02
CPCB26F1/16B26D5/02B26D5/08B26D7/02
Inventor 黄宝超
Owner 黄宝超
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