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Adhesive layer bonding device and method

A sticking device and adhesive layer technology, applied in the direction of sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve the problem of separation of the adhesive layer and the board, and achieve simple structure, simple adhesive layer pasting method, and good control effect

Pending Publication Date: 2018-09-07
BEIJING HANERGY PV TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when tearing off the release film, it is easy to bring up the adhesive layer pasted on the panel, causing the adhesive layer to separate from the panel

Method used

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  • Adhesive layer bonding device and method
  • Adhesive layer bonding device and method
  • Adhesive layer bonding device and method

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Embodiment Construction

[0067] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meanings as commonly understood by those skilled in the art. Before further describing the embodiments of the present invention in detail, some terms for understanding the embodiments of the present invention are defined.

[0068] In the embodiment of the present invention, the "first adhesive surface" and "second adhesive surface" involved are two opposite adhesive surfaces in the adhesive covering layer M.

[0069] A release film N is arranged on the first sticking surface of the adhesive covering layer M, and when the adhesive covering layer M is rolled together, the release film N separates the first sticking surface and the second sticking surface of the adhesive covering layer M .

[0070] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further describ...

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Abstract

The invention discloses an adhesive layer bonding device and method, and belongs to the field of bonding technology. The adhesive layer bonding device comprises a compressing mechanism and a driving mechanism, wherein the compressing mechanism is used for bonding a bonding covering layer on a substrate; the driving mechanism is used for driving the compressing mechanism to move; and the compressing mechanism comprises an initial pressing segment and a secondary pressing segment. The driving mechanism is used for driving the initial pressing segment of the compressing mechanism to provide a primary pressure for the bonding covering layer, and the secondary pressing segment is used for providing a secondary pressure for the bonding covering layer, so that the bonding covering layer is prevented from being moved from the bonding substrate by a release film, and the bonding covering layer is firmly bonded to the bonding substrate. The adhesive layer bonding device has the advantages of simple structure, simple usage method and high controllability.

Description

technical field [0001] The invention relates to the field of bonding technology, in particular to an adhesive layer pasting device and method. Background technique [0002] The solar cell assembly can convert light energy into electrical energy, and it includes: a solar chip, and two protective plates (such as glass plates) respectively arranged on the upper surface and the lower surface of the solar chip. In order to prevent foreign liquid, dust and other impurities from entering between the two boards, an insulating adhesive layer needs to be provided between the peripheries of the two boards. Wherein, the adhesive layer sticking device is used to improve the adhesive force between the adhesive layer and the panel. [0003] In the related art, while tearing off the release film, the adhesive layer is pressed tightly on the board. However, when the release film is torn off, it is easy to bring up the adhesive layer pasted on the panel, causing the adhesive layer to be sep...

Claims

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Application Information

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IPC IPC(8): H01L31/18
CPCH01L31/18Y02P70/50
Inventor 高智红张大鹏张继凯
Owner BEIJING HANERGY PV TECH CO LTD
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