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Circuit layer and aluminum base conduction process

A circuit layer, aluminum-based technology, applied in the field of circuit and aluminum-based conduction process circuit boards, can solve problems such as difficult product quality assurance, high production costs, complicated processes, etc., to improve product structure, reduce production costs, Overcome the effect of complicated process

Inactive Publication Date: 2018-09-07
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a circuit layer and aluminum-based conduction process to solve the problems in the prior art such as complicated process, high production cost, and difficulty in guaranteeing product quality.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] A circuit layer and aluminum-based conduction process, comprising the following steps:

[0023] S1. The aluminum base material is cut according to the processing size;

[0024] S2. Drill peripheral tool holes, the tool holes are mainly used for processing blind hole positioning and silk screen conductive ink filling positioning;

[0025] S3. Drill blind holes from the copper skin of the circuit layer to the direction of the aluminum substrate at the conduction position between the circuit layer and the aluminum substrate;

[0026] S4. Drill holes in the aluminum sheet with silk screen printing conductive ink, the aperture size is 0.2-0.3mm larger than the blind hole, and make the aluminum sheet screen;

[0027] S5. In the blind hole of the aluminum substrate, use the aluminum sheet screen printing conductive ink to fill the blind hole with conductive ink to ensure that the ink is connected to the copper sheet at the hole position;

[0028] S6. After filling the conduc...

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PUM

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Abstract

The invention discloses a circuit layer and aluminum base conduction process. A production method comprises the steps as follows: a blind hole is drilled to an aluminum substrate from a circuit layerthrough a dielectric layer on the aluminum substrate, the blind hole is filled with conductive resin ink and the ink covers a copper sheet of the circuit layer at the same time, so that the copper sheet of the circuit layer and an aluminum base are conducted through the conductive ink. According to the circuit layer and aluminum base conduction process, the production process level of the aluminumsubstrate and the product structure are improved, the production cost is reduced, the quality of a product is stable and controllable, and the problems that the process is complicated, the productioncost is high and the quality of the product cannot be easily ensured in the prior art are solved.

Description

technical field [0001] The invention belongs to the technical field of manufacturing aluminum-based printed circuit boards, and in particular relates to a method for manufacturing a circuit board with a circuit and an aluminum-based conduction process. Background technique [0002] Metal-based printed circuit board is a special printed circuit board, which is widely used in various fields such as home appliances, automobiles, aviation, medical treatment, and military affairs. Metal-based printed circuit boards can be divided into copper substrates, aluminum substrates, stainless steel substrates, etc. according to the type of metal substrates. There are certain differences in their manufacturing processes due to different substrates. For example, aluminum substrates cannot be realized by conventional electroplating processes. The conduction between layers, but many products are designed with partial circuit layer and aluminum base conduction to achieve the effect of groundin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 李仁荣
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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