Solder powder production device and production method capable of feeding automatically and stably

Abstract

The invention relates to a solder powder production device and a production method capable of feeding automatically and stably. The device comprises a melting furnace and a feeding furnace mutually connected through a conveying pipe, and an atomizing barrel connected with the feeding furnace through a feeding pipe, wherein the feeding furnace comprises a feeding furnace body with a furnace cover,a feeding furnace nitrogen input pipe directly inserted to the bottom part of the feeding furnace body from the center of the feeding furnace body, a feeding furnace nitrogenization electromagnetic valve and a feeding furnace bottom part pressure sensor on the feeding furnace nitrogen input pipe, a feeding furnace top part pressure sensor, a feeding furnace exhaust port and a feeding furnace exhaust electromagnetic valve; and the melting furnace comprises a melting furnace body with a furnace cover, a melting furnace nitrogen input pipe directly inserted to the bottom part of the melting furnace body from the center of the melting furnace body, a melting furnace nitrogenization electromagnetic valve and a melting furnace bottom part pressure sensor on the melting furnace nitrogen input pipe, a melting furnace top part pressure sensor, a melting furnace exhaust port and a melting furnace exhaust electromagnetic valve. According to the solder powder production device and the production method capable of feeding automatically and stably provided by the invention, the atomizing barrel can be stably fed controllably at constant speed.

Description

technical field [0001] The invention relates to the technical field of welding powder production equipment and production methods. Background technique [0002] Solder material is an indispensable connection material in the electronics industry. The application of surface mount technology (STM) with solder paste as the main connection material makes the electronic assembly process more efficient and miniaturized. SMT technology has become the mainstream of electronic assembly technology. Solder paste is mainly composed of solder powder and solder paste, of which the weight ratio of solder powder accounts for about 88-90%. Solder powder is one of the most important materials for preparing solder paste. In the production process of solder powder, tin-based alloy melt The atomizing tool head sprayed into the atomizing barrel is atomized. The traditional feeding system is to melt the alloy directly in the melting furnace, and install a conduit at the bottom or side of the meltin...

AI Technical Summary

Problems solved by technology

Solder paste is mainly composed of solder powder and solder paste, of which the weight ratio of solder powder accounts for about 88-90%. Solder powder is one of the most important materials for preparing solder paste. In the production process of solder powder, tin-based alloy melt The atomizing tool head sprayed into the atomizing barrel is atomized. The traditional feeding system is to melt the alloy directly in the melting furnace, and install a conduit at the bottom or side of the melting furnace to transport the alloy liquid to the atomizing tool head. As the liquid level of the alloy liquid in the melting furnace decreases, the bottom pressure drops, and the flow rate of the transported alloy liquid will also decrease and become unstable. It is necessary to manually add materials to keep the liquid level constant, but adding alloy ingots will cause the temperature of the alloy liquid to drop. The requirements of the atomization process cannot be met. At the same time, the alloy liquid in the tin melting furnace is too long to stand still, which will lead to alloy segregation. It is necessary to use a stirring tool to make the composition uniform, but it will cause alloying corrosion between the stirring tool and the tin-based alloy liquid to bring in impurities Into the alloy liquid

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