Device heat dissipation structure parameter configuration method and system based on big data analysis

A technology for equipment heat dissipation and structural parameters, which is applied in the direction of electrical equipment structural parts, cooling/ventilation/heating transformation, electrical components, etc. The effect of accuracy

Active Publication Date: 2018-09-14
GUANGDONG PLANNING & DESIGNING INST OF TELECOMM +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to address the technical problem of high cost in the above-mentioned equipment heat dissipation method, and provide a method and system for configuring equipment heat dissipation structure parameters based on big data analysis, computer storage media and equipment

Method used

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  • Device heat dissipation structure parameter configuration method and system based on big data analysis
  • Device heat dissipation structure parameter configuration method and system based on big data analysis
  • Device heat dissipation structure parameter configuration method and system based on big data analysis

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Embodiment Construction

[0049]The technical solution of the present invention will be described in detail below in combination with specific embodiments and accompanying drawings, so as to make it more clear.

[0050] like figure 1 Shown is an application environment diagram of an embodiment of a device heat dissipation structure parameter configuration method based on big data analysis. The device heat dissipation structure parameter configuration method based on big data analysis can be applied to a device heat dissipation structure parameter configuration system. The device to be configured Configure the heat dissipation structure parameters. like figure 1 Shown includes the current equipment heat dissipation structure parameter configuration terminal and its internal structure. The terminal includes a processor connected through the system bus, a non-volatile storage medium, a network interface, an internal memory, and an input device. The non-volatile The storage medium stores an operating sys...

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Abstract

The invention relates to a device heat dissipation structure parameter configuration method and system based on big data analysis, a computer storage medium and devices. The method comprises the stepsas follows: air inlet temperatures, air outlet temperatures, air inlet areas and air deflector angles of multiple first devices are acquired, wherein the type, model and running environment of the first devices are identical with those of a to-be-configured device; the difference between the air inlet and outlet temperatures of each first device is determined according to the acquired air inlet temperature and the acquired air outlet temperature of each first device; a first association relation among the difference between the air inlet temperature and the air outlet temperature, the air inlet area, the air outlet area and the air deflector angle of each device of the type and model in the running environment is determined according to the difference between the air inlet temperature andthe air outlet temperature of each first device as well as the air inlet area, the air outlet area and the air deflector angle corresponding to each first device; heat dissipation structure parameters of the to-be-configured device are configured according to the first association relation. With the adoption of the scheme, heat dissipation can be realized without a heating dissipation device, andthe heat dissipation cost can be reduced.

Description

technical field [0001] The present invention relates to the technical field of heat dissipation, in particular to a method and system for configuring heat dissipation structure parameters of equipment based on big data analysis, a computing storage medium and equipment. Background technique [0002] During the operation of electronic equipment, heat will be generated due to the consumption of electric energy. If the heat generated is not removed, the operating efficiency and stability of the equipment may be reduced, and the equipment may even be burned. Therefore, it is necessary to configure the heat dissipation structure parameters of the equipment. , so that the device can effectively dissipate heat during operation. [0003] The current equipment heat dissipation method is to directly configure a heat dissipation device for the equipment, so that during the operation of the equipment, the heat dissipation device is driven to operate to remove the heat generated by the e...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20736H05K7/20836
Inventor 李炯城秦怡李钰珑黄伟如陈运动
Owner GUANGDONG PLANNING & DESIGNING INST OF TELECOMM
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