Device heat dissipation structure parameter configuration method and system based on big data analysis

A technology for equipment heat dissipation and structural parameters, which is applied in the direction of electrical equipment structural parts, cooling/ventilation/heating transformation, electrical components, etc. The effect of accuracy
CN108541191AActive Publication Date: 2018-09-14GUANGDONG PLANNING & DESIGNING INST OF TELECOMM +2
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
GUANGDONG PLANNING & DESIGNING INST OF TELECOMM
Publication Date
2018-09-14

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Abstract

The invention relates to a device heat dissipation structure parameter configuration method and system based on big data analysis, a computer storage medium and devices. The method comprises the stepsas follows: air inlet temperatures, air outlet temperatures, air inlet areas and air deflector angles of multiple first devices are acquired, wherein the type, model and running environment of the first devices are identical with those of a to-be-configured device; the difference between the air inlet and outlet temperatures of each first device is determined according to the acquired air inlet temperature and the acquired air outlet temperature of each first device; a first association relation among the difference between the air inlet temperature and the air outlet temperature, the air inlet area, the air outlet area and the air deflector angle of each device of the type and model in the running environment is determined according to the difference between the air inlet temperature andthe air outlet temperature of each first device as well as the air inlet area, the air outlet area and the air deflector angle corresponding to each first device; heat dissipation structure parameters of the to-be-configured device are configured according to the first association relation. With the adoption of the scheme, heat dissipation can be realized without a heating dissipation device, andthe heat dissipation cost can be reduced.
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Description

technical field

[0001] The present invention relates to the technical field of heat dissipation, in particular to a method and system for configuring heat dissipation structure parameters of equipment based on big data analysis, a computing storage medium and equipment. Background technique

[0002] During the operation of electronic equipment, heat will be generated due to the consumption of electric energy. If the heat generated is not removed, the operating efficiency and stability of the equipment may be reduced, and the equipment may even be burned. Therefore, it is necessary to configure the heat dissipation structure parameters of the equipment. , so that the device can effectively dissipate heat during operation.

[0003] The current equipment heat dissipation method is to directly configure a heat dissipation device for the equipment, so that during the operation of the equipment, the heat dissipation device is driven to operate to remove the heat generated by the e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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