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Preparation method of heat dissipation substrate

A technology for heat-dissipating substrates and substrates, used in circuit thermal devices, printed circuit manufacturing, printed circuit components, etc., can solve the problems of warping and uneven stress of heat-dissipating substrates, and achieve the effect of avoiding warpage.

Active Publication Date: 2018-09-18
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a method for preparing a heat dissipation substrate to solve the problem that the metal plate with a target pattern formed after etching will warp the prepared heat dissipation substrate due to uneven stress in the prior art. song problem

Method used

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  • Preparation method of heat dissipation substrate
  • Preparation method of heat dissipation substrate
  • Preparation method of heat dissipation substrate

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preparation example Construction

[0022] figure 1 The flow chart of the preparation method of the heat dissipation substrate provided by the embodiment of the present invention, such as figure 1 As shown, the method may include:

[0023] Step 101, obtaining a material tape with a heat dissipation element.

[0024] The heat dissipation element is conductive or non-conductive.

[0025] The radiating element is a pre-selected heat radiating element with a good surface shape, and it can be an element capable of heat dissipation in the prior art, such as a heat-conducting metal block.

[0026] The material strip may have a heat dissipation element, and connectors are connected to opposite sides of the heat dissipation element; or, the material strip may have at least two heat dissipation elements, at least two heat dissipation elements are arranged according to a predetermined rule, and every adjacent two Connecting pieces are connected between the cooling elements.

[0027] Wherein, the connection between the ...

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Abstract

The invention discloses a preparation method of a heat dissipation substrate. The method comprises the following steps of obtaining a material strip with a heat dissipation element; if the heat dissipation element has conductivity, forming an insulating layer on the outer surface of the material strip; placing the heat dissipation element of the material strip on a preset position of a substrate;covering a conductive layer on the surface of one side, where the heat dissipation element is placed, of the substrate, wherein the heat dissipation element is located between the conductive layer andthe substrate; performing press-fit lamination treatment on the substrate, the heat dissipation element and the conductive layer. Due to the fact that during the obtaining process of the material strip, the heat dissipation element is pre-selected to be good in shape and the thickness of the heat dissipation element is not limited, the warping phenomenon of a heat dissipation substrate formed during the lamination process and caused by the trapezoid shape of the heat dissipation element can be avoided. The smooth proceeding of the follow-up process is ensured. The obtained heat dissipation substrate can conform to the requirement.

Description

technical field [0001] The invention relates to the technical field of production and manufacturing, in particular to a method for preparing a heat dissipation substrate. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. The electronic components supported by the heat dissipation substrate will generate heat during operation, especially for ICs with dense circuit sets and dense hole designs and components with high-power light-emitting diodes, the heat dissipation requirements for the heat dissipation substrate are getting higher and higher. In order to improve the heat dissipation effect, embedding a high thermal conductivity metal block directly in the printed circuit board is one of the effective ways to solve the heat dissipation problem. [0...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0204H05K3/0061
Inventor 韩建国孙学彪吉圣平吴爽
Owner VIVO MOBILE COMM CO LTD