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Tubeless liquid cooling heat dissipating system

A technology of liquid cooling and heat dissipation device, applied in cooling/ventilation/heating transformation, tubular elements, indirect heat exchangers, etc., can solve the problems of inconvenient installation and operation, poor installation flexibility, single design form, etc., to save space. Space, installation and use are flexible and convenient

Active Publication Date: 2018-09-21
APALTEK CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The three parts are connected to form a closed liquid circulation circuit, the heat absorbing device is connected to the heating body, and the power system provides the power for the liquid to circulate in the circuit. The defect of this design is that the three parts are assembled and fixed externally through the connecting pipe, and there are many interfaces. The risk of liquid leakage is high, and it takes up a relatively large space. CN1921743A discloses a tubeless liquid cooling system, but because the overall design is complicated and the design form is relatively simple, there is still the problem of inconvenience in the installation operation. Poor flexibility, so its application is limited

Method used

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  • Tubeless liquid cooling heat dissipating system
  • Tubeless liquid cooling heat dissipating system
  • Tubeless liquid cooling heat dissipating system

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Embodiment Construction

[0046] In order to make the purpose, technical solutions and advantages of the present invention clearer, the various embodiments to be described below will refer to the corresponding drawings, and these drawings constitute a part of the embodiments, which describe various possible implementations of the present invention. kind of embodiment. It is to be understood that other embodiments may be utilized or structural and functional modifications may be made to the embodiments set forth herein without departing from the scope and spirit of the present invention.

[0047] refer to Figure 1 to Figure 3As shown, a tubeless liquid-cooled heat dissipation system of the present invention includes a heat dissipation device 1, a pumping device 2, a water tank 3, and a heat absorbing device 4. The pumping device 2, the heat absorbing device 4, the heat sink 1 and the water tank 3. It is integrated and connected in a pipeless manner, that is, the connecting pipes between the parts are ...

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Abstract

The invention discloses a tubeless liquid cooling heat dissipating system. The system comprises a heat dissipating device, a pumping device, a water tank and a heat absorbing device, the pumping device, the heat absorbing device, the heat dissipating device and the water tank are integrally combined and communicated in a tubeless manner, the inside of the water tank is partitioned into at least two space areas to control the flow direction of liquid, the water tank is provided with a hole groove structure, the pumping device is installed in the hole groove structure and is communicated with the water tank, the water tank is further provided with the heat absorbing device, and the water tank and the heat absorbing device are integrally communicated; the water tank is integrally welded and communicated with the heat dissipating device. The tubeless liquid cooling heat dissipating system adopts an integrated design by providing the hole groove structure, which greatly reduces the floor space occupied by a liquid cooling system, is convenient to operate and install and has good practicability.

Description

technical field [0001] The invention relates to a heat dissipation system, in particular to a tubeless liquid cooling heat dissipation system for electronic equipment. Background technique [0002] At present, liquid-cooled radiators are usually used to cool electronic devices such as computer CPUs, graphics cards, and electronic instrument chips. They are mainly composed of three major parts, namely heat absorbers, power systems, and heat sinks. The three parts are connected to form a closed liquid circulation circuit. The heat absorbing device is connected to the heating body, and the power system provides the power for the liquid to circulate in the circuit. The defect of this design is that the three parts are assembled and fixed externally through the connecting pipe, and there are many interfaces. The risk of liquid leakage is high, and it takes up a relatively large space. CN1921743A discloses a tubeless liquid cooling system, but because the overall design is complic...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20218F28F21/084F28D1/0471F28D1/05366F28F1/126F28D2021/0031F28D1/024H01L23/3672H01L23/473F28F2275/06F28F9/268H05K7/20263H05K7/20272
Inventor 肖启能
Owner APALTEK CO LTD
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