[0046] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the various embodiments to be described below will refer to the corresponding drawings. These drawings constitute a part of the embodiments, which describe various possible implementations of the present invention. Kind of examples. It should be understood that other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein, without departing from the scope and essence of the present invention.
[0047] Reference Figure 1 to Figure 3 As shown, a tubeless liquid cooling heat dissipation system of the present invention includes a heat dissipation device 1, a pumping device 2, a water tank 3, a heat absorption device 4, the pumping device 2, the heat absorption device 4, the heat dissipation device 1 and a water tank 3 It is integrated and penetrated in a pipeless manner, that is, eliminating the connection pipes between the various parts, thereby avoiding leakage at the pipe joints, and reducing the volume of the entire system, simplifying the structure of the system and making it easy to install; The inside of the water tank 3 is divided into at least two space areas to control the flow direction of the liquid, thereby dividing the inside of the water tank 3 into areas such as a water inlet area and a water outlet area to complete the normal heat absorption and heat dissipation cycle of the liquid. A heat absorbing device 4 is also provided and integrally connected through it. The heat absorbing device 4 can be locked at the hole and groove structure of the water tank 3 or directly welded to the water tank 3 to form an integrated structure. The heat absorption device 4 can also be fixed inside the water tank 3, that is, the water tank 3 is integrally formed and forms a heat absorption area. At the same time, the heat absorption device is a metal piece with high thermal conductivity and is welded to the inside of the water tank. Attached to the inner surface of the water tank; it can also be the original structure of the water tank 3, that is, integrated with the water tank 3. When the heat absorption device 4 is placed inside the water tank 3 to dissipate heat from the heating device, the water tank 3 corresponds to the heat absorption device 4 position The outer surface of the heating device can be directly attached to the heating device to conduct heat conduction. The water tank 3 and the heat dissipating device 1 are integrally welded and penetrated. Refer to image 3 , The water tank 3 is provided with a circular hole structure 31 for the pumping device 2 to be installed and can be connected to the water tank 3, so that the water tank is integrated with the pumping device, the heat dissipation device and the heat absorption device Type through connection, and the internal partition of the water tank to control the flow of liquid.
[0048] Through such a structural arrangement, the tubeless liquid cooling heat dissipation system of the present invention minimizes the space occupation and the risk of leakage, the structure between each part is compact, the volume is minimized, and the installation and use are convenient.
[0049] Specifically, refer to figure 2 The pumping device 2 includes a pump housing 21, an impeller 22, a motor 23, and a pump cover member 24, and the pumping device 2 is locked and sealed with the water tank 3 by a sealing device 5. It should be noted that the inner wall of the hole structure can be used as the pump housing of the pumping device, thereby saving the cost of the pumping device, and of course it can also be a complete pumping device.
[0050] Further, the integrated welding method of the water tank 3 and the heat dissipation device 1 includes direct welding through special equipment or welding through a third-party solder medium after the interface of two raw materials is connected. Reference Figure 4 In mode 1, the water tank 3 has a cavity structure 301, and a protrusion 101 on the corresponding part of the heat sink 1 is matched with the cavity structure 301, and the water tank and the heat dissipation can be welded on the contact surface. The device is made in one piece; reference Figure 4 Method 2, by integrally welding the outer peripheral surface 302 at the edge of the water tank 3 and the inner peripheral surface 102 of the corresponding edge of the heat sink 1 to make the water tank and the heat sink integrated; Figure 4 Manner 3, a cooling pipe 103 is provided on the heat sink 1, and a corresponding hole 303 is provided on the water tank 3, which is made by welding the two together.
[0051] Further, the heat absorption device 4 is a metal piece with high thermal conductivity, which is locked and sealed with the water tank 3 by the sealing device 5 or integral welding.
[0052] Referring to Figure 6-a, the outer peripheral surface of the heat absorption device 4 is coated with solder medium, and correspondingly, a circle of solder medium is also coated on the water tank 3, and the heat absorption device 4 and the water tank 3 can be welded integrally through the solder medium; 6-b, the heat-absorbing device 4 can be fixed in the water tank 3 by screwing or welding; referring to Figure 6-c, the heat-absorbing device 4 is a native structure inside the water tank 3, that is, the water tank 3 is integrated with the water tank 3 in advance Shaped heat-absorbing structure.
[0053] It should be noted that the integrated welding process can be directly welded by two kinds of raw materials through special welding equipment or through third-party solder media such as solder paste, solder, and metal glue. For composite materials such as aluminum and aluminum alloys, Special equipment for welding, the sealing device is an elastic rubber sealing ring, an elastic rubber sealing gasket, a gel filling and sealing material, etc.
[0054] Reference figure 1 , figure 2 with Figure 5 The water tank 3 includes three space areas A, B, and C. The heat dissipation device 1 is connected to the area A, and the pumping device 2 pumps the cooling liquid from the area A to the area B. The zone cooling liquid is connected to the space of the C zone through the heat absorption device 4, and the C zone and the A zone are respectively connected to the water inlet and outlet channels of the heat dissipation device 1.
[0055] The liquid circulation workflow is as follows, refer to Figure 5 : The water tank 3 is divided into three working areas A, B and C. Area A is connected to the water outlet of the heat sink 1, and a hole structure 31 is provided on the upper side to install the pumping device 2. A and C can be separated and matched The liquid before and after entering the heat sink 1 is distinguished. The B and C zones are used to distinguish the liquid before and after the heat absorption. The cooling liquid flowing out of the upper half of the heat sink 1 enters the area A through the water outlet ①, and is at the suction of the pumping device 2. Under the action, it flows through ② to the water inlet ③ of the pumping device 2, presses the pumping device 2 to flow out of the water outlet ④ and enters the B zone ⑤, and then enters the heat absorption device 4 water inlet ⑥ in the B zone. The nozzle ⑦ flows out to the C zone, and then returns to the lower part of the heat sink 1 from ⑧ to dissipate and cool, so as to perform the next cycle of heat dissipation.
[0056] Reference Figure 7 , The heat sink 1 is welded to the side of the water tank. This arrangement can be applied to areas where the length of the placement direction is limited, and it is convenient for the heat sink to be arranged in a rectangular area.
[0057] Reference Figure 8 with Picture 9 The pumping device 2 and the heat absorbing device 4 can also be arranged on the side of the water tank 3 to adapt to different application places. For heating elements with different arrangements, the design of the heat dissipation system of the present invention is more flexible.
[0058] Reference Figure 10-1 with 10-2 , There are two water tanks 3 and the two sides of the heat sink 1 are welded to the heat sink 1 as a whole. The bottom surface of each water tank is provided with two heat absorption devices 4, and one pumping device 2 is provided on the side of the water tank; Figure 10-3 The specific circulation process of the liquid is: the cooling liquid flowing out of the upper half of the heat sink 1 enters area A from the water outlet ①, flows through ② to the water inlet ③ of the pumping device 2, and presses from the water outlet through the pumping device 2. ④Enter zone B, and enter the water inlets 5-1 and 5-2 of heat absorption devices 4(1) and 4(2) in parallel (ie respectively) in zone B, and pass through the water outlets 6-1 and 6-2 after absorbing heat Enter zone C, enter the lower part of heat sink 1 through water inlet ⑦, enter zone D through ⑧ after cooling, and then enter the water inlets 9-1 and 9-2 of heat sink 4(3) and 4(4) in parallel, After the heat is absorbed, it flows to the E area through the water outlets 10-1 and 10-2. The upper half of the flow back to the heat sink 1 enters the next cycle.
[0059] Reference Figure 11-1 with Figure 11-2 , The water tank 3 and the heat dissipating device 1 are arranged in a crisscross pattern, a heat absorption device 4 is provided on both sides of the bottom of the water tank 3, and a pumping device 2 is provided on the top of one side of the water tank 3; Figure 11-3 with Figure 11-4 , The liquid circulation process of the liquid cooling heat dissipation process is: the cooling liquid flowing out from the left side of the lower half of the heat sink 1 enters the A zone of the water tank 3 through ①, and then enters the water inlets 2-1 and 2 of the heat absorption devices 4a and 4b in parallel -2, after absorbing heat, it flows to zone B through water outlets 3-1 and 3-2, enters pumping device 2 through water inlet ④, and flows out of water outlet ⑤ into zone C after being pressurized by pumping device 2 It flows into the right side of the lower half of the heat sink 1, and flows back to the left side exit ① of the lower half of the heat sink through the U-shaped loop of water chambers on both sides of the heat sink 1, thus entering the next heat dissipation cycle.
[0060] Reference Figure 12-1 to Figure 12-4 , There are two pumping devices 2a and 2b between the four heat dissipation devices 1(1), 1(2), 1(3) and 1(4) on the top of the water tank 3, on the opposite side of the water tank 3 There are four heat absorption devices 4(1), 4(2), 4(3) and 4(4), of which two heat absorption devices are arranged between the four heat dissipation devices; Figure 12-5 , The specific circulation process of the cooling liquid is: the cooling liquid flowing out of the upper half of the heat sink 1(1) and 1(2) enters the A zone from 1-1, 1-2, and flows evenly to the inlet of the pumping device 2a, 2b The water outlets 2-1 and 2-2, after being pressurized by the pumping device, enter the B area through the outlets 3-1 and 3-2, and evenly enter the upper half of the heat sink 1(3), 1(4) in the B area , Flows back to the lower half of the heat sink 1(3), 1(4) through the U-shaped waterway, flows into the C zone through the water outlets 5-1, 5-2, and then enters the heat sink 4(1), 4 evenly (2), 4(3) and 4(4) water inlets 6-1, 6-2, 6-3 and 6-4, after heat absorption, from the water outlets 7-1, 7-2, 7-3 And 7-4 flow to the D area, enter the lower half of the heat sink 1(1) and 1(2), flow back to the upper half of the heat sink 1(1) and 1(2) through the U-shaped waterway, and enter the next cycle .
[0061] Reference Figure 13-1 to 13-3 , The ultra-thin liquid-cooled heat dissipation system consists of a water tank 3 and welded heat dissipation devices 1a and 1b at both ends of the water tank 3. The two sides of the water tank are respectively integrally welded with a pumping device 2 and a heat absorption device 4; The heat dissipation is mainly carried out through the flat U-shaped tube 100, and the turbo fan 200 is arranged on the side of the heat dissipating device to dissipate the U-shaped tube 100. Therefore, the heat dissipating device can be made into a thinner shape. Figure 13-4 The specific circulation process of the cooling liquid is as follows: the cooling liquid flowing out of the upper half of the heat sink 1a enters Zone A from the water outlet ①, flows through ② to the water inlet ③ of the pumping device 2, and presses the pumping device 2 from the outlet. The water outlet ④ flows out into zone B, enters the upper half of the heat sink 1b in zone B, enters the lower half of the heat sink 1b after passing through the U-shaped waterway, enters zone C through the water outlet ⑤, and passes through the water inlet ⑥ of the heat sink 4 through the suction After being heated, it flows out from the water outlet ⑦ into the D zone, returns to the lower half of the heat sink 1a through the water inlet ⑧, and then returns to the upper half of the heat sink 1a through the U-shaped waterway for the next cycle.
[0062] Reference Figure 14-1 to Figure 14-3 , The water tank 3 is divided into two space areas A and B, which are the water inlet area and the water outlet area of the heat sink 1 respectively. The pumping device 2 directly pumps the cooling liquid from the space of area A to the inlet of the heat absorption device 4 The water outlet is connected to the B zone space through the water outlet of the heat absorption device 4. Specifically, refer to Figure 14-3 , The cooling liquid flowing out of the left side of the heat sink 1 enters area A through ①, and then enters the water inlet ② of the pumping device 2, and is pressurized by the pumping device 2 from the water outlet ③ into the water inlet ④ of the heat absorption device 4, after absorbing heat Enter area B from the water outlet ⑤ through ⑥, then enter the right side of the heat sink 1, and return to the left side of the heat sink through the loop loop of the heat sink, thus entering the next cycle. Of course, the inside of the water tank can also be divided into multiple space areas to control the circulating flow direction of the liquid, such as three, four, etc.
[0063] It can be seen from the above embodiments that the water tank of the present invention can be provided with N≥2 pumping devices, N≥2 heat absorption devices, N≥2 heat dissipation devices connected and penetrated, and the specific form of the installation Diverse.
[0064] The above descriptions are only preferred embodiments of the present invention. Those skilled in the art know that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the present invention.
