Method for fabricating mask having micro-nano pattern structure and nanolithography method
A technology of pattern structure and fabrication method, applied in the fields of mask plate fabrication and nano-lithography, can solve the problems of inability to realize micro-nano patterns, high production cost, and difficulty in beam pen preparation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0038] like figure 1 As shown, the present invention provides a method for manufacturing a polymer mask with a micro-nano pattern structure, comprising the following steps:
[0039] S101: On the silicon wafer, using a patterning process to define patterns to be etched;
[0040] S102: After step S101 is completed, perform anisotropic etching on the surface of the silicon wafer, and prepare a micro-nano pattern arrangement structure of a specific shape and a specific size on the silicon wafer by controlling the etching process;
[0041] S103: After step S102 is completed, apply the polymer solution on the surface of the silicon chip with a micro-nano pattern arrangement structure of a specific shape, and transfer the micro-nano pattern structure on the surface of the silicon chip to the polymer;
[0042] S104: After step S103 is completed, take out the transferred polymer, and the polymer with micro-nano pattern structure is used as a photolithography mask for photolithography ...
Embodiment 2
[0059] In this embodiment, on a 4-inch large-size planar substrate 31 silicon wafer, based on a mask manufacturing method with a micro-nano pattern structure and a nano-lithography process, nanowires are prepared, wherein the polymer mask 34 has a nanometer The feature size of the planar part of the pattern is smaller than the light wavelength (L<λ), which can realize the total reflection lithography exposure technology.
[0060] Such as figure 1 As shown, on the silicon wafer 12, the photolithographic patterning process is used to define the pattern 11, and the silicon wafer 12 is anisotropically etched, and a micro-nano pattern structure of a specific shape is prepared on the silicon wafer 12 to generate a micro-nano pattern. Structured silicon wafer 12 .
[0061] Coating the polymer solution on the surface of the silicon chip 12 with a micro-nano pattern structure of a specific shape, the polymer solution is a polydimethylsiloxane (polydimethylsiloxane, PDMS) solution, whe...
Embodiment 3
[0065] The embodiment of the present invention also provides a nano-dot prepared on a non-planar substrate glass rod (500 μm in diameter) based on a polymer mask with a nano-dot pattern structure and a nano-lithography process, wherein the planar part of the nano-pattern The characteristic size of is larger than the wavelength of light (L>λ).
[0066] First follow figure 1 , to prepare a polymer mask with a nano-dot pattern structure. then follow Figure 5 The process flow, on the non-planar substrate glass rod (diameter 500μm), based on the polymer mask with nano-dot pattern structure, nano-dots are prepared by nano-lithography process.
[0067] Such as Figure 5 As shown, firstly, a positive photoresist 52 is coated on the surface of a non-planar substrate glass rod 51 (500 μm), then placed on a hot plate at 120° C., and baked for 2 minutes to cure the positive photoresist 52 . A polymer mask 54 with a micro-nano pattern structure is then used as a photolithography mask....
PUM
| Property | Measurement | Unit |
|---|---|---|
| Size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


