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Generation method and system for pressure welding element backdrill via hole file on the basis of Cadence Skill

A technology for generating systems and crimping parts, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of heavy workload and low design efficiency, improve quality, improve accuracy, and avoid missed drilling and the effect of multiple drills

Active Publication Date: 2018-09-28
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method and system for generating back-drilled via files of crimped parts based on Cadence Skill, aiming at solving the problem of back-and-forth confirmation of a large amount of back-drilling information when the PCB factory performs back-drilling, the workload is relatively large, and the design The problem of low efficiency, to achieve improved design efficiency, design accuracy

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  • Generation method and system for pressure welding element backdrill via hole file on the basis of Cadence Skill
  • Generation method and system for pressure welding element backdrill via hole file on the basis of Cadence Skill
  • Generation method and system for pressure welding element backdrill via hole file on the basis of Cadence Skill

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Embodiment Construction

[0036] In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below through specific implementation methods and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily lim...

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Abstract

The invention provides a generation method and system for a pressure welding element backdrill via hole file on the basis of Cadence Skill. The method comprises the following steps that: S1: operatingthe Cadence Skill to collect the relevant information of a pressure welding element; S2: inputting a pressure welding element bit number and the length information of a pressure welding element fisheye; S3: automatically selecting a pressure welding element difference which conforms to a set condition to add a backdrill to the via hole; and S4: generating the pressure welding element backdrill via hole file. By use of the method, the problems of large workload and low design efficiency since a great quantity of backdrill information needs to be confirmed for multiple times when a PCB (PrintedCircuit Board) factory carries out backdrill can be solved, design efficiency is improved, the problems of drilling missing and excessive drilling when the PCB factory caries out the backdrill can beavoided, the design accuracy of an engineer is improved, information confirmation timeliness is greatly shortened, and quality generated when the PCB factory beat boards can be effectively improved.

Description

technical field [0001] The invention relates to the field of PCB design, in particular to a Cadence Skill-based method and system for generating back-drilled through-hole files of crimped parts. Background technique [0002] In the PCB design stage of the server board, the quality of the board and the efficiency and quality of signal transmission are currently very high, and then the selection of some materials is very challenging. It is necessary to consider the cost, the ability to transmit signal quality, and some differences during production. stabilizing factor. At this stage, the PCB wiring density is extremely high and there are many board layers. In order to ensure that high-speed signals can realize more functions and data sharing through the interconnection of different devices, some high-quality crimping parts are selected to improve the ability of signal transmission. [0003] However, the problem of stubs (stumps) formed by high-speed signal lines cannot be wel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 郭怀军
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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