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Method for manufacturing ord line connection zone of three-dimensional storage and three-dimensional storage

A memory and connection area technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problem of contact deviation and other problems, achieve the effect of easy control, small size, and avoid etching punch-through

Pending Publication Date: 2018-10-09
YANGTZE MEMORY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The deviation of the contact portion from the corresponding stepped structure is also a common defect

Method used

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  • Method for manufacturing ord line connection zone of three-dimensional storage and three-dimensional storage
  • Method for manufacturing ord line connection zone of three-dimensional storage and three-dimensional storage
  • Method for manufacturing ord line connection zone of three-dimensional storage and three-dimensional storage

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Embodiment Construction

[0034] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0035] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways than those described here, so the present invention is not limited by the specific embodiments disclosed below.

[0036] As indicated in this application and claims, the terms "a", "an", "an" and / or "the" do not refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other st...

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Abstract

The invention relates to a method for manufacturing a word line connection zone of a three-dimensional storage and the three-dimensional storage. The method includes steps of providing a semiconductorstructure, wherein the semiconductor structure is provided with a substrate, a stacking layer covering the substrate and a rigid mask layer covering the stacking layer and the stacking layer includesmultiple first material layers and multiple second material layers stacked in an alternating manner; patterning the rigid mask layer so as to form a plurality of openings, wherein the stacking layeris exposed from the openings; forming multiple contact holes in the stacking layer through the openings, wherein the contact holes reach the first material layers of different preset depth separately;forming an insulation layer on the side wall of each contact hole; and forming a plurality of conducting layer among the second material layers and forming a contact part in each contact hole. According to the invention, defects due to offset of the contact parts from corresponding step structures can be avoided.

Description

technical field [0001] The invention mainly relates to a semiconductor manufacturing method, in particular to a method for manufacturing a word line connection area of ​​a three-dimensional memory and the three-dimensional memory. Background technique [0002] In order to overcome the limitation of the two-dimensional memory, the industry has developed a memory having a three-dimensional (3D) structure, which improves integration density by three-dimensionally arranging memory cells on a substrate. [0003] In a three-dimensional memory such as 3D NAND flash memory, the memory array may include a core area and a stair step (SS) area. The stepped area is used for drawing out contact portions of the control gates in each layer of the memory array, and serves as a word line connection area. These control gates are used as word lines of the memory array to perform operations such as programming, erasing and writing, and reading. [0004] In the manufacturing process of 3D NAND...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/11578H01L27/11573H01L27/1157H10B43/20H10B43/35H10B43/40
CPCH10B43/35H10B43/20H10B43/40
Inventor 刘峻
Owner YANGTZE MEMORY TECH CO LTD
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