Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Phase change memory and method for forming phase change memory

A phase change memory and phase change layer technology, applied in static memory, digital memory information, information storage and other directions, can solve the problems of low read and write efficiency, slow read and write speed, etc., to improve read and write speed, increase read and write speed , the effect of small contact area

Inactive Publication Date: 2018-10-09
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing phase change memory has the disadvantages of slow reading and writing speed and low reading and writing efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Phase change memory and method for forming phase change memory
  • Phase change memory and method for forming phase change memory
  • Phase change memory and method for forming phase change memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Phase change memory has the disadvantages of slow read and write speed and low read and write efficiency.

[0034] Combined with the formation method of a phase change memory, the reasons for the slow read and write speed and low read and write efficiency of the formed phase change memory are analyzed:

[0035] figure 1 It is a structural schematic diagram of a method for forming a phase change memory.

[0036] Please refer to figure 1 The step of forming the phase change memory includes: providing a substrate 10; forming a dielectric layer 11 on the substrate 10; forming a heating structure 12 in the dielectric layer 11, and the dielectric layer 11 exposes the heating structure 12 ; forming a phase change layer 13 on the heating structure 12 .

[0037] Wherein, the contact surface between the heating structure 12 and the phase change layer 13 is parallel to the surface of the substrate 10 . The step of forming the dielectric layer 11 and the heating structure 12 in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a phase change memory and a method for forming the phase change memory. The method comprises a step of providing a substrate, a step of forming a heating layer on the substrate, a step of forming a phase change layer on a sidewall surface of the heating layer, wherein only a sidewall of the heating layer only is in contact with the phase change layer. The phase change layer is formed on the sidewall surface of the heating layer, and since the thickness of the heating layer can be made smaller in the forming process of the heating layer, the size is smaller than aminimum size of the surface of the heating layer. Since the thickness of the heating layer is small and the phase change layer is located on the sidewall surface of the heating layer, the contact area of the phase change layer and the heating layer can be small. The contact area of the phase change layer and the heating layer is small, the phase change layer material which undergoes a phase change in reading and writing data is few, thus the phase change time can be shortened, and the reading and writing speeds of the phase change memory are increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a phase-change memory and a forming method thereof. Background technique [0002] With the development of information technology, the amount of stored information has increased dramatically. The increase in the amount of stored information has promoted the rapid development of phase change memory, and at the same time put forward higher requirements for the read and write efficiency of phase change memory. [0003] Phase change memory (PCM), abbreviated as PCM, is a storage device that stores data by using the difference in conductivity of special materials when they transform between crystalline and amorphous states. [0004] The basic structure of a memory cell of a PCM includes a phase change layer. The phase change layer material is a very small chalcogenide alloy, which can quickly change from an ordered crystalline state to a disordered amorphous state...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L45/00G11C13/00H01L27/24H10N80/00
CPCG11C13/0004H10B63/00H10N70/231H10N70/8616H10N70/8413H10N70/826H10N70/8828H10N70/063H10N70/8613H10N70/021H10N70/026
Inventor 张超周儒领张庆勇
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products