Cooling assembly and electronic apparatus

A technology for heat dissipation components and electronic devices, which is applied in electrical digital data processing, digital data processing components, instruments, etc., can solve problems such as chip power consumption and electronic equipment temperature rise, avoid local overheating, improve grip, The effect of preventing damage to components

Inactive Publication Date: 2018-10-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of el

Method used

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  • Cooling assembly and electronic apparatus
  • Cooling assembly and electronic apparatus
  • Cooling assembly and electronic apparatus

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0018] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-e...

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Abstract

The invention discloses a cooling assembly and an electronic apparatus. The cooling assembly comprises a middle frame comprising a first region and a second region which are opposite, a circuit boardarranged in the second region, a heat source chip arranged on the circuit board and located between the circuit board and the middle frame, and a heat pipe comprising an evaporation section and a condensation section, wherein the first region forms a battery cabin used for accommodating a battery; the evaporation section is connected with the heat source chip; and the condensation section is connected with the battery cabin, so that heat of the heat source chip is transferred to the battery cabin. Through the cooling assembly, the damage of components caused by local overheat of the electronicapparatus can be avoided; and in addition, by heat dispersion, the hand feeling of holding the electronic apparatus is improved, so that the user experience is improved.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a heat dissipation component and an electronic device. Background technique [0002] The interior of an electronic device generally includes a control chip (ie, a core processor). With the diversification and intelligence of its functions, the requirements for the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are very common. [0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise. Contents of the invention [0004] A technical solution adopted in the present application is to provide a heat dissipation assembly, which includes: a middle fra...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/203G06F2200/201
Inventor 田汉卿
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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