A kind of preparation method of electronic component

Abstract

The invention discloses a preparation method for an electronic component. The preparation method comprises the following steps: S1, heating ordinary glass in a combustion vessel to 600-650 DEG C, andthen rapidly and uniformly cooling the glass to obtain tempered glass, mixing 65-70% by weight of the tempered glass with 30-35% by weight of alumina, and carrying out crushing with a crusher for 30-50 minutes to form a particulate matter; S2, grinding the particulate matter obtained in the step S1 into powder, adding an organic solvent, carrying out stirring at 50-60 DEG C for 40-50 min, then adding acrylic resin, sodium hexametaphosphate and a toughening agent; S3, adding a weak base into slurry obtained in the step S2 to adjust the pH value of the slurry to 7.3-7.7, and then coating a filmsubstrate with the slurry through printing to prepare a conductive electrode; and S4, covering the film substrate with a silver foil having a thickness of 0.1-0.2 mm, carrying out integral molding with a hot press, carrying out cooling and then carrying out drying for 1-2 hours so as to obtain the electronic component. The preparation method provided by the invention has the advantages of high processing speed and high production efficiency; and the obtained electronic component has high hardness, good toughness and excellent electrical conductivity.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a method for preparing electronic components. Background technique [0002] Electronic components are the basis of electronic products. Commonly used electronic components include resistors, capacitors, inductors, potentiometers, and transformers. With the continuous development of artificial intelligence technology, signals in different frequency bands need to be processed in actual circuits, which puts forward higher requirements for electronic components. In order to meet the multiple uses of the same electronic component, the traditional single material manufacturing Electronic components can no longer meet the needs of use. It is necessary to introduce two or more materials to meet the design requirements. However, at present, the appearance and electrical performance of electronic components made of more than two materials often have poor conditions. [0003]...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for preparing electronic components, which has the advantages of fast processing speed, high production efficiency, cost saving, high hardness, good toughness, and excellent electrical conductivity, and solves the existing problems. The preparation method has low production efficiency, slow processing, high processing cost, and the obtained electronic components have low hardness, poor toughness, and general electrical conductivity, which greatly reduces the service life of electronic components.