Monolithic double metal plate packaging structure and packaging method thereof
A bimetal plate and packaging structure technology, which is applied in the manufacture of semiconductor devices, electric solid devices, semiconductor/solid devices, etc., can solve problems such as cost and long cycle, achieve yield and stability improvement, simple process, and economical manufacturing cost effect
Active Publication Date: 2020-04-28
JCET GROUP CO LTD
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The cost and cycle of encapsulation mold manufacturing are very long, especially for the development of new packages, the time and cost of mold development often account for a considerable proportion of the time and cost of the entire development task
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0049] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
[0050] It should be noted that terms such as “upper” and “lower” used herein to express relative positions in space are for the purpose of description to describe the relative position of one unit or feature relative to another unit or feature as shown in the drawings. Relationship. The spatially relative terms may be intended to encompass different orientations of the package in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" other elements or features would then be oriented "above" the ot...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention reveals a monomer double-metal-plate packaging structure and a packaging method thereof, and the structure comprises a circuit layer; a chop which is electrically connected with the circuit layer and is located above the circuit layer; a solder mask layer which is disposed below the circuit layer in a stacked manner, wherein the solder mask layer is provided with a plurality of windowing regions; solder balls which are implanted in the windowing regions of the solder mask layer so as to communicate with the circuit layer; an injection molding material which encapsulates the chipand the circuit layer and is located above the solder mask layer. According to the invention, two metal plates are employed for packaging, so there is no need of a conventional mold with a cavity forencapsulation, and the mold does not need to be replaced for different products, thereby saving the manufacturing cost. The packaging structure obtained through the method greatly improves the yield and stability, and the technology is simple.
Description
technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a single bimetal plate packaging structure and a packaging method. Background technique [0002] In the existing semiconductor encapsulation process, the injection molding material is usually used to cover the semiconductor chip and the lead frame by injection, so that the chip and its related contacts can be isolated from the external environment, and the purpose of protecting the chip and the contacts and integrating the components . In the encapsulation equipment, an encapsulation mold is required. The encapsulation mold is composed of an upper mold and a lower mold. The upper mold and the lower mold can move between the open and closed positions, and a lead frame is placed between the upper mold and the lower mold. , a mold cavity is defined in the closed position, and the encapsulation material is transported from the supply device to the mold cavity t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31H01L23/552
CPCH01L21/56H01L23/3114H01L23/552H01L2224/16245
Inventor 梁志忠刘恺王亚琴
Owner JCET GROUP CO LTD