Electronic package and its supporting structure and manufacturing method

Abstract

The invention provides an electronic packing piece, and a bearing structure and a manufacturing method thereof. A shielding piece is arranged on a bearing structure of an electronic element. The electronic element and the shielding piece are covered by a covering layer. A shielding layer contacting the shielding piece is formed on the covering layer. The shielding piece is arranged in an insertedmanner. Thus, the height exceeding the bearing structure can be reduced and the whole height of the electronic packing piece is reduced.

Description

technical field [0001] The invention relates to a package technology, especially a semiconductor package capable of preventing electromagnetic interference and its manufacturing method. Background technique [0002] With the evolution of semiconductor technology, semiconductor products have developed different packaging product types, and in order to improve electrical quality, many semiconductor products have a shielding function to prevent electromagnetic interference (EMI for short). [0003] Such as Figure 1A As shown, the existing radio frequency (Radio frequency, referred to as RF) module 1 for avoiding EMI electrically connects a plurality of electronic components 11 such as radio frequency and non-radio frequency chips on the upper side of a substrate 10, and sets the metal frame 12 on the On the substrate 10 and between each of the electronic components 11, each of the electronic components 11 and the metal frame 12 is covered with an encapsulation layer 13 such as...

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Problems solved by technology

[0004] However, if Figure 1B As shown, in the existing radio frequency module 1, the metal frame 12 is bonded to the substrate 10 through the solder material 16, so the solder material 16 will bear the internal stress from the metal frame 12 and the expansion of the subsequent thermal process, causing the The structure of the solder material 16 is easily damaged, causing solder extension (solder extension), so that the solder material 16 will overflow to the electrical contact pad 100 of the substrate 10, thus causing the electronic component 11 to short circuit.

[0005] In addition, the height H of the metal frame 12 beyond the surface of the substrate 10 (the height of the solder material 16 can be ignored) is approximately equal to the overall height H of the metal frame 12, so the overall height of the radio frequency module 1 is difficult to reduce, resulting in subsequent applications. The electronic products of the radio frequency module 1 are difficult to meet the requirements of lightness, thinness, shortness and smallness

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