Unlock instant, AI-driven research and patent intelligence for your innovation.

Differential mems microphone

A microphone and motor technology, applied in the field of microphones, can solve the problems of expensive, increased device size, small package size, etc.

Active Publication Date: 2021-05-25
KNOWLES ELECTRONICS INC
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods require the use of two transducers, which can be expensive and increase the overall device size
[0006] As package sizes continue to shrink, maintaining high SNR performance in smaller package sizes becomes more difficult
As mentioned, dual parallel motor designs have been used, but these cannot be used in very small package sizes
[0007] Issues with previous methods have caused some users to be dissatisfied with these previous methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Differential mems microphone
  • Differential mems microphone
  • Differential mems microphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The present disclosure provides a differential and compact dual-diaphragm microelectromechanical system (MEMS) motor. As used herein, "motor" includes components, such as diaphragms and backplates, that transform acoustic energy into electrical signals. According to various embodiments, the present disclosure provides better signal-to-noise ratio (SNR) performance in smaller sized devices than previous approaches.

[0032] now refer to figure 1 , an example of a MEMS microphone 100 is described. The microphone 100 includes a base 102 (e.g., a printed circuit board), a microelectromechanical systems (MEMS) device 104 (including a diaphragm and a backplate), an integrated circuit 106 (e.g., an application specific integrated circuit), and enclosing the MEMS device 104 and the integrated circuit 106. Cover or shroud 108 . An opening 110 passes through the base 102, making the microphone a bottom-opening microphone. However, it is contemplated that opening 110 may pass ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

MEMS motor and MEMS microphone. This disclosure relates primarily to microphones and related components. An example microelectromechanical system MEMS motor includes: a first diaphragm; a second diaphragm disposed in a generally parallel relationship to the first diaphragm, the first diaphragm and the second diaphragm an air gap is formed between the diaphragms; and a back plate disposed in the air gap between the first diaphragm and the second diaphragm and in contact with the first diaphragm and the The second diaphragm is in a generally parallel relationship.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit to US Provisional Application No. 62 / 291,152 "DIFFERENTIALMEMS MICROPHONE," filed February 4, 2016, the contents of which are incorporated herein by reference in their entirety. technical field [0003] This application relates to microphones and, more particularly, to microelectromechanical systems (MEMS) providing differential signals. Background technique [0004] Different types of acoustic devices have been used over the years. One type of device is a microphone. In a microelectromechanical system (MEMS) microphone, the MEMS die includes a diaphragm and a backplate. The MEMS die is supported by a substrate and enclosed by an enclosure (eg, a cup or a lid with walls). The opening can be through the base plate (for bottom opening devices) or through the top of the housing (for top opening devices). In any event, sound energy passes through the opening, moving the diap...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04H04R1/04B81B3/00
CPCH04R1/04H04R19/005H04R19/04B81B3/0021H04R3/005H04R2201/003H04R2410/05
Inventor M·昆特兹曼W·康克林桑·博克·李
Owner KNOWLES ELECTRONICS INC