Electric connecting structure, display panel and connecting-binding method of conductive connecting part thereof

An electrical connection structure and display panel technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of bonding process failure, inability to crush, conductive particle aggregation, etc., to improve the failure risk and improve the yield effect.

Inactive Publication Date: 2018-11-02
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the existing technical solution, if the distribution of conductive particles inside the ACF is uneven or the crimping stress is not uniform, there may be a risk of local aggregation of conductive particles or failure to crush during crimping, resulting in failure of the bonding process

Method used

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  • Electric connecting structure, display panel and connecting-binding method of conductive connecting part thereof
  • Electric connecting structure, display panel and connecting-binding method of conductive connecting part thereof
  • Electric connecting structure, display panel and connecting-binding method of conductive connecting part thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] figure 1 is a side cross-sectional view of the electrical connection structure according to Embodiment 1 of the present invention.

[0034] refer to figure 1 , according to Embodiment 1 of the present invention, an electrical connection structure is proposed. The electrical connection structure includes a first conductive adhesive layer 10 , an anisotropic conductive adhesive layer 30 and a second conductive adhesive layer 20 which are sequentially stacked. Of course, the present invention is not limited thereto, and the electrical connection structure may also include other necessary components.

[0035] Specifically, the surface of the first conductive adhesive layer 10 facing the anisotropic conductive adhesive layer 30 has a plurality of grooves 11 . The surface of the second conductive adhesive layer 20 facing the anisotropic conductive adhesive layer has a plurality of protrusions 21 matching the grooves 11 . The protrusion 21 is accommodated in the groove 11 ...

Embodiment 2

[0044] image 3 is a top view of the display panel according to Embodiment 2 of the present invention. Figure 4 It is a side cross-sectional view of the electrical connection structure of the display panel according to Embodiment 2 of the present invention before hot pressing. Figure 5 It is a side cross-sectional view of the electrical connection structure of the display panel according to the second embodiment of the present invention after hot pressing.

[0045] refer to image 3 , Figure 4 and Figure 5As shown, a display panel is provided according to Embodiment 2 of the present invention. The display panel includes a display part 200 and a binding part 300 located at a side of the display part 200 . The display panel further includes a conductive component 400 and the above-mentioned electrical connection structure 100 . It can be understood that the present invention is not limited thereto, and the display panel according to the embodiment of the present invent...

Embodiment approach

[0048] As an embodiment of the present invention, the conductive component 400 includes a driving chip and / or a flexible panel. Of course, the conductive component 400 may also include other components that need to be fixed on the binding portion 300 through the anisotropic conductive adhesive layer 30 , which is not limited in the present invention.

[0049] As a preferred embodiment of the present invention, the conductive component 400 is bonded and connected to the binding part 300 through the electrical connection structure 100 by means of hot pressing. refer to Figure 4 , Before hot pressing, the protrusion 21 and the groove 11 are opposite but not engaged. refer to Figure 5 After hot pressing, the protrusion 21 is accommodated in the groove 11 , so that the anisotropic conductive adhesive layer 30 is continuously distributed between the groove 11 and the protrusion 21 .

[0050] In the display panel of the embodiment of the present invention, the conductive compone...

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PUM

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Abstract

The invention discloses an electric connecting structure. The electric connecting structure comprises a first conductive adhesive layer, an anistropic conductive adhesive layer and a second conductiveadhesive layer which are sequentially arranged in a stacked way, wherein the surface, facing the anistropic conductive adhesive layer, of the first conductive adhesive layer is provided with multiplegrooves, the surface, facing the anistropic conductive adhesive layer, of the second conductive adhesive layer is provided with multiple protrusions matched with the grooves, the protrusions are contained in the grooves to make the anistropic conductive adhesive layer continuously distributed between the grooves and the protrusions. The invention also discloses a display panel and a connecting method. The conductive particles in the anistropic conductive adhesive layer can be prevented from segregating through engagement between the protrusions and the grooves between the first conductive adhesive layer and the second conductive adhesive layer, the risk of binding process invalidity caused by conductive particle abnormity can be remarkably improved, and the binding process yield can be improved.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an electrical connection structure, a display panel and a connection binding method for conductive connection parts thereof. Background technique [0002] With the rapid development of LCD (Liquid Crystal Display) panels, LCD displays have gradually become the mainstream of display technology due to their advantages such as ultra-thin, light weight, no radiation, and stable performance. [0003] Among them, the OLED (Organic Light-Emittiong Diode) display panel industry is a new growth point for the future display industry. Every process in the OLED display panel manufacturing process directly affects the final performance of the product. [0004] The bonding (bonding) process is to realize the electrical connection between the array substrate and the FPC (flexible circuit board) through ACF (anisotropic conductive adhesive). The structure and material composition of...

Claims

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Application Information

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IPC IPC(8): G02F1/1345
CPCG02F1/13452
Inventor 袁朝煜王超梁
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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